Project: Technology Assessment – From Wafer Processing to Component Performance (TechWB)
Quality requirements are constantly rising in the development and testing of advanced microsensors. In particular, the ongoing trend toward miniaturization coupled with increasing functionality demands precise analysis of wafer materials, substrates, and coatings. As part of the newly approved “TechWB” investment project (Technology Testing – From Wafer Process to Component Performance), the CiS Research Institute is modernizing its analytical infrastructure with two state-of-the-art systems.
A new wafer inspection system will enable precise, low-particle defect analysis in the submicrometer range. This enables the quality of patterned surfaces to be reliably assessed as early as the initial stages of production.
Additionally, a high-resolution 3D laser scanning microscope expands the range of analytical capabilities. To ensure the longevity and reliability of the technologies, this system enables non-destructive, three-dimensional characterization. Compared to time-consuming electron microscopy methods or complex external large-scale equipment, laser scanning microscopy allows for significantly more efficient sample analysis with comparable precision.
With these strategic new investments, the CiS Research Institute is sustainably strengthening its technological foundation for the research and production of reliable, miniaturized microsystems.
The research and development work described was supported by the Federal Ministry for Economic Affairs and Energy (BMWE) – funded by the federal government’s “Infrastructure and Climate Neutrality” special fund.
