New methods in the development and application of silicon sensors – this was the topic of the MEMS workshop on 6th November 2024.
The keynote speech “AI and sensors” by Prof. Martin Golz (Schmalkalden University of Applied Sciences) kicked things off. What is AI? What expectations and challenges are associated with it? What is intelligence? What types are there? His research focuses on “adaptive signal analysis using methods of computer-based intelligence”. Using examples, he presented the wide range of tasks in data and signal analysis as well as pattern recognition in technical fields of application and which software and hardware solutions have been developed to date.
The industry presentations by duotec GmbH on the topic of submounts and Endress+Hauser SE+Co KG on the use of MEMS systems in E+H products provided an insight into practical applications.
The CiS Research Institute gave three presentations on selected research and development projects. In his presentation, Dr. Ingo Tobehn discussed the development of redundant temperature sensors based on Si temperature diodes and platinum resistor elements, which can be used at temperatures of up to 300 °C. Stefan Völlmeke reported on the results of the HEP project (high-end acceleration sensors). The new very high-resolution capacitive MEMS acceleration sensors are suitable for inclination and leveling measurements. In another presentation, Johannes Zeh and Sebastian Pobering gave an insight into the challenges and solutions for minimizing assembly stresses at chip and sensor level.
The presentations by Niklas Haus from TU Braunschweig on MEMS vibrometers and by Michael Simon-Najasek from Fraunhofer IMWS on TEM characterization of implantation-dependent crystallographic defects in pressure sensors were also much discussed. Prof. Marion Wienecke from Materion GmbH explained the development of special palladium coatings for resistant pressure sensors for the safety of systems and pipes in the hydrogen economy and Prof. Jens Müller from TU Ilmenau presented special composite substrates for sensor applications under harsh operating conditions.
Prof. Gabriele Schrag from the Technical University of Munich closed the event with her presentation on the modeling and design of MEMS.
In the end, everyone agreed that the topic of the MEMS workshop remains exciting and many questions are still open – a good basis for a continuation.
