The development of integrated circuits (ICs) is a complex task, and full functionality is rarely achieved on the first attempt. To evaluate prototypes, some of these chips must be electrically connected and put into operation. Highly integrated ICs often have several hundred electrical connections arranged in a dense grid of a few hundred micrometers or less. Developing a production-ready housing (e.g., with solderable electrical connections) for such chips is time-consuming and costly, and the process must be repeated if further adjustments to the IC are necessary.
In such situations, unconventional wire bonding techniques can be a good alternative. Modern bonding systems can achieve the required high density of connections—even if these are arranged in multiple rows or as a dense array. In combination with a suitable test circuit board, the electrical connection for testing the chips can thus be established without relying on expensive multilayer circuit boards or application-specific interposers. For particularly time-critical developments, the wire bonding process can be trained in parallel with IC manufacturing using test structures. Such test structures, which reflect the chip thickness and electrode geometry of the IC, can be fabricated at the CiS Research Institute using laser direct exposure processes. With such preparation, it is possible to connect the finished ICs within a few working days—without complex multilayer solder contact metallization—and subsequently characterize them.
INOVA Semiconductors GmbH (Munich) recently took advantage of this opportunity. The manufacturer of ICs for high-speed data transmission, LED, and sensor control had the first prototypes of its new chip generation fabricated at the CiS Research Institute. Thanks to careful joint preparation, fully functional assemblies were made available within a few days of the first chips becoming available, enabling Inova to meet the tight schedule leading up to the tape-in of the revised chip design.
We will be showcasing demonstrators of these sophisticated wire bonding techniques at the following trade shows:
Precision Fair – 12th-13th November 2025, Brabanthallen in ‘s-Hertogenbosch, Hall 6, Booth 202
Compamed – 17th-20th November 2025, Messe Düsseldorf, Hall 8a, Booth F35-2
