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Recording of our latest MEMS webinar is available [Video]

3. November 2021/in Events, MEMS

The speakers Dr. Klaus Ettrich, Sebastian Pobering and Michael Blech held a webinar on October 21 on the topic of “Piezoresistive silicon pressure sensors for higher operating temperatures up to approx. 300°C”. In the webinar, which lasted about 45 minutes, there was an introduction to the structure and essential properties of this type of sensor, and in the second part, solutions for extending the operating temperature range up to approx. 300°C were presented

Innovative joining technologies and growth core HIPS at the IMAPS Fall Conference

19. October 2021/in Events, Force, MEMS, MOEMS, Packaging

The IMAPS Autumn Conference meets in Munich from 21-22.10.21. The CiS Research Institute reports on innovative joining technologies in the lecture and shows new results of SiCer technology research with the growth core HIPS in the accompanying exhibition

Miniaturized thermopiles as well as array arrangements – Project start MyTZe

15. October 2021/in IR, MOEMS

Miniaturized thermopiles and array arrangements for significantly more compact and more powerful sensors and measuring devices are to be developed in the currently launched MyTZe research project

Innovative preload force sensor technology for bolted joints

5. October 2021/in Energy, Events, Force, MEMS

At the Windmesse Symposium in Hamburg, visitors will learn more about technical innovations, economic aspects and the market development of on- and offshore wind energy. In his bolt sensor lecture on October 5, 2021, Arndt Steinke will provide information on “Innovative preload force sensors for bolted connections”

Start of the NewPARZ research project – New micro-optical particle counter for large volume flows

24. September 2021/in Measurement, Medical technology, MOEMS

Based on the established 90° scattered light setup, a new optoelectronic particle counter for gas-bearing particles at high volume throughput is developed. Demonstrators are tested for applications in pharmaceutical laboratories

20 years of Forschungs- und Technologieverbund Thüringen e.V.

21. September 2021/in Events

The Forschungs- und Technologieverbund Thüringen e.V. (FTVT) celebrated its 20th anniversary with a ceremony in the ballroom of Haus Dacheröden in Erfurt with numerous guests. The event was opened with a greeting from Thuringia’s Prime Minister Bodo Ramelow and a contribution from Thuringia’s Minister of Economics Wolfgang Tiefensee

CiS Research Institute is a founding member of the association “Advanced UV for Life e.V.”

14. September 2021/in Events, Measurement, Medical technology, Packaging, Personnel, UV

As successor of the BMBF consortium of the same name, it bundles the competences from industry and science along the entire value chain – from the concept to the UV semiconductor to its application. Dr. Olaf Brodersen, Senior Business Unit Manager MOEMS at the CiS Research Institute, was elected to the new board of directors

Two start-up teams benefit from all-round support by CiS Research Institute

10. September 2021/in Automotive, Events, Medical technology, MOEMS, Packaging

Two start-ups from Jena were able to pitch an LOI with the CiS Research Institute yesterday during the now fourth edition of the technology competition getstarted2gether. We are looking forward to a six-month intensive cooperation with the founding teams of Coachwhisperer GmbH and 4Pilots GmbH. The audience award of the FTVT, endowed with 1,000 euros, also went to Coachwhisperer GmbH

IVAM Hightech Summit 2021

7. September 2021/in Events, Medical technology, MOEMS

Dr. Martin Schädel, Head of the MOEMS Business Unit, will talk about “Sensor solutions for measuring vital parameters in the ear” in Stage 2 “Medical Technology: Microtechnology for Mobile Diagnostics and Therapy” on Wednesday, August 25, 2021 as part of the IVAM Hightech Summit

AniTHA – Analog integrated temperature compensation for high temperature applications

16. August 2021/in MEMS, Pressure

The newly designed piezoresistive pressure sensor chips with analog integrated temperature compensation are suitable for operating temperatures of up to about 300°C. The sensor is based on an intelligent connection of the measuring bridge with passive components. The basis is an intelligent interconnection of the measuring bridge with passive components

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