Fully automatic micro assembly center
A new micro assembly center expands the technological basis for new concepts for the fully automated production of application-specific UV LED modules in different series sizes. The modular system concept enables the most important AVT assembly steps to be carried out in one device. Special functions for laser soldering, solder paste dispensing and jetting, pick & place of fragile components, a highly accurate yet fast adjustment of UV LEDs, innovative joining processes like thermosonic bonding can be realized with this platform. The individual processes are qualified separately during development and later automated. The so-called plug and play concept allows a quick change between different process configurations as well as the integration of new and in-house developed assembly units.
The requirements for UV LED assembly are manifold. They range from the assembly of a wide variety of UV LED types in a very confined space, to the development of high-power surface emitters with extremely good heat dissipation, to wafer-level packaging. Similarly, standard components for drive electronics can be processed using classic joining technology.
In the project “Advanced UV for Life”, funded by the program “Zwanzig20 – Partnerschaft für Innovation” awarded by the German Federal Ministry of Education and Research, the bandwidth, flexibility and accuracy of the system are tested for industrial applications.
With these possibilities, the research and development services of CiS Forschungsinstitut für Mikrosensorik GmbH set a new milestone for the rapid transfer and upscaling of the developed processes to an industrial environment.
Project presentation at:
Hannover Messe, April 25-29, 2016, Hannover, Hall 4, Booth F 34
SENSOR+TEST, May 10-12, 2016, Nuremberg, Hall 5 Booth 5-364
