Our exhibition at the Innovation Day of SMEs of the BMWi on June 7, 2018 in Berlin generated good feedback and high interest.
Represented for the first time at this showcase and communication platform with its own booth, our research institute presented the INNO-KOM project “Wafer Level Packaged Pressure Sensor With Through Silicon Vias”. It demonstrates WLP (wafer level packaging)-based bulk piezoresistive micromechanical pressure sensors using silicon direct bond interconnects and through-silicon vias with increased chemical resistance and improved contact and long-term stability. Examples from the field of biomedical development and manufacturing for in vivo vital parameter measurement as well as sensors for optical blood pressure measurement and for incorporation into biomedical devices for feedback systems for blood glucose stabilization were also vividly demonstrated.
