The CiS Workshop with focus on packaging and interconnect technology will take place on 12th September 2023 in Erfurt under the motto “Current developments in hybrid and wafer-level assembly”. Look forward to exciting contributions as well as ample opportunity for professional exchange and networking
In the SiDMeses research project, the long-term stability of hybrid silicon strain sensors was significantly improved by a targeted and accelerated reduction of the mechanical assembly stress and a precise, extremely parallel and symmetrical structure was generated
The new project “Thermopiles with carbon nanotube absorbers” investigates the integration of thin coatings of carbon nanotubes on thermopiles with the aim of enabling higher absorption at low cost
In the newly started project KoSenDi (Compact Sensor Unit for the Measurement of Magnetic Fields Using Diamond Fluorescence), scientists at the CiS Research Institute are working on the miniaturization of a magnetic field sensor based on sticksoff defects (NV centers) in diamond
The new research project NivLer at the CiS Research Institute addresses the development of a retrofit kit for non-invasive pressure measurement in process pipes in order to be able to non-destructively record and digitize various condition variables
The CiS Research Institute is partner of the started joint project “DiaTip”. Together with the partners, the efficient production of diamond tips as well as a suitable assembly process for the joining of two components “active microcantilever” and “diamond tip” shall be developed
In the new project Cryo-Resistance both the further development of industrially manufactured resistance thermometers in cooperation with UST Umweltsensortechnik GmbH and several layout variants based on semiconductor technologies of the CiS Research Institute are pursued
The “Hivos” project follows the industry’s request and aims at higher automation by deposition and patterning of adhesive coatings at wafer level and the associated improved assembly accuracy. Innovative materials and processes are also intended to increase value creation at wafer/benefit level
With the started project “Piezo-junction effect based on-chip multi-sensors” the effects of environmental influences on differently designed pn-junctions or more complex bipolar lateral and vertical on-chip silicon structures will be investigated at the CiS Research Institute
Paris will host the ICTFFM 2023: 17th International Conference on Thin Films and Functional Materials on July 10-11, 2023. In the session “Engineering And Physical Sciences Research,” Dr. Li Long and Prof. Thomas Ortlepp from the CiS Research Institute will report on research results of the study of polycrystalline silicon thin films
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Germany
Tel.: +49 361 663 1410
E-Mail: info@cismst.de
