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Project start: Inkan – Innovative sensor cooling system for dosimeters

14. November 2023/in Medical technology

The newly launched project “Inkan – Innovative sensor cooling system for dosimeters” by the CiS Research Institute addresses the development of non-invasive dosimeters for measuring radiation doses in medical X-ray diagnostics. In contrast to conventional dosimeters, which are operated at room temperature, the aim here is to achieve an operating temperature of around minus 10 degrees Celsius

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https://www.cismst.de/wp-content/uploads/news-2023-11-14-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-11-14 15:30:152023-11-22 15:33:29Project start: Inkan – Innovative sensor cooling system for dosimeters

New generation of IR emitters and Si strain gauges with a high K-factor

8. November 2023/in Events, Force, Medical technology, MEMS, MOEMS, Pressure

From 13th to 16th November 2023, the COMPAMED, the world’s leading trade fair for the medical technology supply sector, will open its doors in Düsseldorf and we will be presenting applications of silicon-based sensor technology in medical technology at our booth H23-4 in hall 8A within the joint stand of the IVAM trade association.
As part of the COMPAMED HIGH-TECH Forum by IVAM, Dr. Martin Schädel, Business Unit Manager MOEMS, will present selected research and development results on the topic of “Silicon-based microsensors for medical and life science applications” on 13th November

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https://www.cismst.de/wp-content/uploads/news-2023-11-08-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-11-08 15:24:072023-11-22 15:29:58New generation of IR emitters and Si strain gauges with a high K-factor

Project start: QuBS – Quantum mechanical device simulation

2. November 2023/in MEMS, Quantum, Simulation & Design

Various simulation strategies and models are used in the development of modern microsystems technology. In the new QuBS project, preliminary research is being carried out to improve the design and properties of MEMS components by means of simulation. Quantum mechanical modelling is used to describe the physical behaviour of the components

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https://www.cismst.de/wp-content/uploads/news-2023-11-02-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-11-02 10:44:332023-11-03 10:05:01Project start: QuBS – Quantum mechanical device simulation

CiS Research Institute at the 10th MikroSystemTechnik Congress

23. October 2023/in Events, MEMS

The 10th MikroSystemTechnik Congress starts today. Dr Thomas Frank, head of the MEMS department at the CiS Research Institute, will be presenting selected results of research and development projects in various lecture and poster sessions in Dresden

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https://www.cismst.de/wp-content/uploads/news-2023-10-23-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-10-23 13:45:362023-10-25 08:46:03CiS Research Institute at the 10th MikroSystemTechnik Congress

Energy efficiency through investment in high-temperature plant

20. October 2023/in CiS general, Energy

The CiS Research Institute was able to invest in a modern high-temperature facility of the latest generation. The plant with many technical innovations is characterised by a high degree of flexibility for both series production and research and development

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https://www.cismst.de/wp-content/uploads/news-2023-10-20-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-10-20 09:53:212023-10-20 10:26:59Energy efficiency through investment in high-temperature plant

Sensor technology in transformation

11. October 2023/in Events, MEMS, MOEMS, Quantum

As a member of the board of the sensor cluster detect (SensorikNet e.V.) and managing director of the CiS Research Institute for Microsensorics, Prof. Thomas Ortlepp will give a talk today in the session “Smart Home – Sensor Technology” at the symposium “Sensorik im Wandel”. The event is the first joint initiative of the IVAM Microtechnology Association and the Thuringian Sensor Cluster “detect”

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https://www.cismst.de/wp-content/uploads/news-2023-10-11-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-10-11 09:42:432023-10-11 09:42:59Sensor technology in transformation

Save the Date – CiS LABday 2023

10. October 2023/in Events, MEMS, Packaging, Pressure

On 9th November 2023, the CiS LABday will take place at the CiS Research Institute with a focus on “Piezoresistive Silicon Pressure Sensors”. Prof. Thomas Ortlepp and Dr. Klaus Ettrich will be the scientific directors. With practical content in the form of demonstrators, live demonstrations as well as vivid presentations, the CiS LABday conveys interesting facts about piezoresistive silicon pressure sensors

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https://www.cismst.de/wp-content/uploads/news-2023-10-10-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-10-10 14:48:282023-11-03 14:03:32Save the Date – CiS LABday 2023

Workshop “Simulation and Design” successfully completed

27. September 2023/in Events, Simulation & Design

At the end of our 3-part hybrid workshop series, the topic of “Modelling in Microsystems Technology” was intensively examined on 26th September 2023. Representatives from science and industry discussed methods, software and the use of artificial intelligence for the simulation and design of silicon MEMS and MOEMS

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https://www.cismst.de/wp-content/uploads/news-2023-09-27-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-09-27 13:47:002023-09-29 09:50:04Workshop “Simulation and Design” successfully completed

CiS Workshop on Modelling in Microsystems Engineering

18. September 2023/in Events, Simulation & Design

Next week, on 26th September 2023, the CiS workshop “Modelling in Microsystems Engineering” will take place in Erfurt as a hybrid event. In microsystems technology, reliable simulation tools are a prerequisite for supporting the design of components and systems. The workshop will discuss mechanical and optical simulations as well as multidomain modelling, with a focus on silicon MEMS and MOEMS

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https://www.cismst.de/wp-content/uploads/news-2023-09-18-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-09-18 14:29:192023-09-18 14:29:36CiS Workshop on Modelling in Microsystems Engineering

Successful workshop on assembly and connection technology

13. September 2023/in Events, Packaging

At the workshop “Current developments in hybrid and wafer-level assembly” on 12th September 2023 in Erfurt, experts from mechanical and plant engineering, semiconductor foundries, scientists and AVT experts discussed individual processes in packaging and interconnection technology, their technical status and future potential with a focus on silicon-based microsystems. All participants agreed: the workshop offered numerous, exciting contributions as well as opportunities for exchange, networking and idea generation

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https://www.cismst.de/wp-content/uploads/news-2023-09-13-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-09-13 16:22:002023-09-18 14:26:27Successful workshop on assembly and connection technology
Page 12 of 47«‹1011121314›»
  • Project completion KTB: Complex tools for component simulation

    9. December 2025
  • 7th Silicon Science Award – Award ceremony at Waferbond 2025

    4. December 2025
  • Start of ZEBA project: Non-destructive image evaluation using AI-supported imaging to determine burst pressure

    26. November 2025
  • Future prospects at the 4th Sensor and Application Technology Conference in Shenzhen, China

    18. November 2025
  • CiS Research Institute at COMPAMED 2025

    17. November 2025

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