The 10th MikroSystemTechnik Congress starts today. Dr Thomas Frank, head of the MEMS department at the CiS Research Institute, will be presenting selected results of research and development projects in various lecture and poster sessions in Dresden
The CiS Research Institute was able to invest in a modern high-temperature facility of the latest generation. The plant with many technical innovations is characterised by a high degree of flexibility for both series production and research and development
As a member of the board of the sensor cluster detect (SensorikNet e.V.) and managing director of the CiS Research Institute for Microsensorics, Prof. Thomas Ortlepp will give a talk today in the session “Smart Home – Sensor Technology” at the symposium “Sensorik im Wandel”. The event is the first joint initiative of the IVAM Microtechnology Association and the Thuringian Sensor Cluster “detect”
On 9th November 2023, the CiS LABday will take place at the CiS Research Institute with a focus on “Piezoresistive Silicon Pressure Sensors”. Prof. Thomas Ortlepp and Dr. Klaus Ettrich will be the scientific directors. With practical content in the form of demonstrators, live demonstrations as well as vivid presentations, the CiS LABday conveys interesting facts about piezoresistive silicon pressure sensors
At the end of our 3-part hybrid workshop series, the topic of “Modelling in Microsystems Technology” was intensively examined on 26th September 2023. Representatives from science and industry discussed methods, software and the use of artificial intelligence for the simulation and design of silicon MEMS and MOEMS
Next week, on 26th September 2023, the CiS workshop “Modelling in Microsystems Engineering” will take place in Erfurt as a hybrid event. In microsystems technology, reliable simulation tools are a prerequisite for supporting the design of components and systems. The workshop will discuss mechanical and optical simulations as well as multidomain modelling, with a focus on silicon MEMS and MOEMS
At the workshop “Current developments in hybrid and wafer-level assembly” on 12th September 2023 in Erfurt, experts from mechanical and plant engineering, semiconductor foundries, scientists and AVT experts discussed individual processes in packaging and interconnection technology, their technical status and future potential with a focus on silicon-based microsystems. All participants agreed: the workshop offered numerous, exciting contributions as well as opportunities for exchange, networking and idea generation
A total of five outstanding works by young researchers were honored yesterday with the Silicon Science Award. The award ceremony took place on 4th September 2023, as part of the opening event of the international 60th Ilmenau Scientific Colloquium “Engineering for a Changing World” in the Audimax of the Ilmenau University of Technology
The CiS Workshop with focus on packaging and interconnect technology will take place on 12th September 2023 in Erfurt under the motto “Current developments in hybrid and wafer-level assembly”. Look forward to exciting contributions as well as ample opportunity for professional exchange and networking
In the SiDMeses research project, the long-term stability of hybrid silicon strain sensors was significantly improved by a targeted and accelerated reduction of the mechanical assembly stress and a precise, extremely parallel and symmetrical structure was generated
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