The new ZIM project IR-Batch focuses on the development of new assembly technologies for infrared components based on polymer-free joining technologies for use at high temperatures and in extreme environmental conditions. The CiS Research Institute is responsible for technology development
The central idea of integrating several small and therefore fast active areas into a single chip was initially achieved through the hybrid integration of individual, very small (1×1 mm²) chips, which were ultimately converted into variants of monolithically integrated arrays
The aim of the new DotIR research project is to achieve a reduction in electromigration by doping MoSi2 in order to improve the service life of infrared emitters. In addition, it is being investigated whether doping can increase emissivity in the infrared spectral range
Miniaturized, infrared-sensitive detectors are required for contact-free temperature measurements as well as imaging and spectroscopic applications in the spectral range from 1 to 15 µm. For this purpose, technologies for membrane generation were developed, selected and realized in the completed MyTZe project
In the newly launched CNT-IR project, carbon nanotubes and encapsulations are to be used to increase the emission of the IR emitter while maintaining the same electrical output. Such light sources are used in particular for optical gas sensors (NDIR sensors)
During the Hannover Messe, which starts next week, the CiS Research Institute will be presenting an electrically isolated incremental sensor at the joint Thuringian stand in Hall 3, Stand D76. As part of the GalGiS funding project, new silicon technologies have been developed to achieve such galvanic isolation at chip level
In the completed NIVo research project, a new thermopile sensor was developed that works on the principle of isothermal detection of infrared radiation and is exempt from the front side. This combination enables the production of a new type of high-performance sensor in the field of thermography
On 30th January 2024, SPIE Photonics West will start in San Francisco, one of the international events for solutions, components and system support for the optics and photonics industry. The CiS Forschungsinstitut will once again be exhibiting at the German Pavilion in Hall F at booth 4205-05 in the Moscone Center. We will also be represented with five contributions at the accompanying conferences, which begin on 27th January 2024
The project “Voltage management in thin membranes for IR emitters and sensors”, which was launched at the beginning of November 2023, is dedicated to the important technology optimization for the production and operation of infrared (IR) sensor chips. The aim of the optimizations is to increase the yield during production and to increase the service life of the components in use
Paris will host the ICTFFM 2023: 17th International Conference on Thin Films and Functional Materials on July 10-11, 2023. In the session “Engineering And Physical Sciences Research,” Dr. Li Long and Prof. Thomas Ortlepp from the CiS Research Institute will report on research results of the study of polycrystalline silicon thin films
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