The CiS Research Institute has developed a cost-effective technology for the production of highly stable laser illuminators in a batch process. In this process, up to 20,000 of these modules are mounted on a glass wafer. The VCSEL-based laser modules are characterized by high beam quality
At the CiS Research Institute, technological processes for silicon wafers have been developed, with which a reproducible sensitivity dU/dT, i.e. the slope of the voltage versus temperature, could be achieved
The CiS Research Institute is showing a micro-laser illumination for analytics at the Sensor+Test trade fair: Laser light has special properties. Its beam can be guided narrowly over long distances and its spectrum is very pure. These properties are made usable for small sensors with the micro-laser illumination
Using MEMS wafer technologies and a silicon photodiode array with embedded laser light source (naked VCSEL), the CiS Research Institute has succeeded in integrating the complete optical sensing of the pressure-sensitive, membrane (Silizum) in a very flat package space – comparable to capacitive or piezoresistive sensors
The 3D structuring of silicon is becoming increasingly important for optical and opto-electronic applications in microsystems technology. For the reliable and low-loss coupling of optical fibers to photodiodes, the CiS Research Institute developed new microstructuring technologies for the fabrication of cavities with flank angles of 45° and 90° and high optical absorption of the sensitive coupling surface
Low-temperature silicon direct bonding has gained significantly in importance in recent years. In addition to the possibilities of vertical integration, it opens up new process technology opportunities through the application of wafer-level packaging as a post-process in sensor manufacturing
Konrad-Zuse-Str. 14
99099 Erfurt
Germany
Tel.: +49 361 663 1410
E-Mail: info@cismst.de
