The measurement and control of temperatures is one of the most common applications for sensors and is becoming increasingly important due to the requirements of industry 4.0 applications, e.g. in plant and process control. Recently, an important milestone was reached in a development project for high-temperature diodes
At Sensor+Test 2018 in Nuremberg, the CiS Research Institute will present a high-temperature pressure sensor system suitable for series production with an operating temperature of up to 300°C
Our exhibition at the Innovation Day of SMEs of the BMWi on June 7, 2018 in Berlin generated good feedback and high interest. Here, our research institute presented the INNO-KOM project “Wafer Level Packaged Pressure Sensor With Through Silicon Vias”
These days, the delegation trip “Exploring the Economy of Tomorrow. Thuringia visits China 2018” under the leadership of Wolfgang Tiefensee, Thuringian Minister for Economy, Science and Digital Society, is taking place. Today – after six months of interior construction – the “German-Chinese MEMS Smart Sensor Institute” in Nanjing could be ceremoniously opened. The founding of the institute, which was completed on November 28 last year, is an initiative of the Chinese “Der Sensor Group” and the CiS Research Institute in Erfurt
With the repeated participation as an exhibitor on the community stand of the Thuringian State Development Corporation, the CiS Research Institute could register consistently positive feedback in numerous discussions with interested parties from industry and medium-sized businesses
On 28 November 2017, the “German-Chinese MEMS Smart Sensor Institute” was founded in Jiangsu, China. The aim is the joint development and industrialisation of novel MEMS sensors and systems. The CiS Research Institute in Erfurt serves as a role model. The independent research institute, which is close to the economy, was selected because it has been developing MEMS for over 20 years and has been very successful in transferring them to industrial production
Piezoresistive pressure sensor chips from CiS are used where high precision, stability and reliability are required. The same sensor principle is now also used for force measurement in silicon strain gages. The strain-sensitive resistors are monolithically integrated into wafer-thin chips as Wheatstone measuring bridge
For the first time, CiS presented a new sensor for testing special bolt in safety-relevant applications at the joint stand of LEG Thüringen at the Hannover Messe 2017. Described as “Bolt 4.0”, the model impressed the trade visitors
At Sensor+Test 2017, the CiS Research Institute for Microsensors presents highly stable, media-resistant barometric pressure sensors in MEMS technology
Synthetic diamond coatings can be manufactured on an industrial scale to be CMOS-compatible. The manufacturing and processing costs are comparable to those of other technologies, such as passivation or contacting. In order to implement diamond coatings as passive as well as active functional layers in sensors and to evaluate their industrial applicability, the CiS Research Institute is dedicated to pressure measurement in aggressive working environments and intelligent thermal management in current R&D projects
Konrad-Zuse-Str. 14
99099 Erfurt
Germany
Tel.: +49 361 663 1410
E-Mail: info@cismst.de
