A miniaturized force sensor measures the forces at catheter tips that occur between the guide wire (catheter) and blood vessels during insertion. The KASYS mini-chip, just 200 x 220 x 640 µm in size and thus just twice as wide as a hair, is the heart of a haptic assistance system that will simplify catheterizations in medicine in the future and reduce the risk of injury
Using MEMS wafer technologies and a silicon photodiode array with embedded laser light source (naked VCSEL), the CiS Research Institute has succeeded in integrating the complete optical sensing of the pressure-sensitive, membrane (Silizum) in a very flat package space – comparable to capacitive or piezoresistive sensors
Microstructured reactors have been successfully finding their way into the laboratories and production facilities of large-scale and fine chemistry as well as medicine for several years. Worldwide research activities impressively show that the use of the micro-process engineering components can achieve a multitude of reaction engineering advantages in chemical processes
Low-temperature silicon direct bonding has gained significantly in importance in recent years. In addition to the possibilities of vertical integration, it opens up new process technology opportunities through the application of wafer-level packaging as a post-process in sensor manufacturing
CiS has many years of expertise in the field of impedance sensor technology. In addition to the classic field of humidity measurement, new fields of application are being developed
Based on special chip and assembly technologies from the CiS Research Institute, the ILK Institut für Luft- und Kältetechnik gGmbH, Dresden has developed a cost-effective multi-parameter system for continuous monitoring of humidity, bubble formation, temperature and level in refrigerant systems
Konrad-Zuse-Str. 14
99099 Erfurt
Germany
Tel.: +49 361 663 1410
E-Mail: info@cismst.de
