Burgermann brings Christmas menu
Since a classic joint end-of-year event with all colleagues is not possible this year, the management of the CiS Research Institute engaged the Burgermann Foodtruck. With a sophisticated corona-compliant ordering procedure, all employees were able to choose from different burger menus and enjoy their pre-Christmas thank-you for their commitment in this not easy year yesterday lunchtime
Efficient coupling optics for single photon detectors (EkoPHo)
A new technology platform is used for targeted optical adaptation of an SNSPD silicon chip stack. This is an extremely compact construction of a superconducting detector with efficient signal coupling in a chip compound as well as integrated optics and mounting of a fibre
SiCer technology for high performance sensor systems
At InnoCON Thuringia on 24th November 2020, Dr. Olaf Brodersen will explain the latest results of the growth core HIPs and the SiCer technologies to be developed therein for high performance sensor systems. The InnoCON starts as online event at 3:00 PM
Valuable seconds – continuously monitoring blood pressure with optical sensors
The CiS Research Institute has been working for more than 10 years on the development of photoplethysmographic sensors for the continuous measurement of vital parameters such as heart rate, heart rate variability and blood oxygen saturation. The most recent result is a miniaturised sensor that also monitors blood pressure in the ear
10th Advisory Board Meeting of the AUVL Consortium
The 10th advisory board meeting of the Advanced UV for Life (AUVL) consortium is taking place today as an online event. The CiS Research Institute is the coordinator of the working field “Modules & Measurement Technology”. Prof. Thomas Ortlepp will give a lecture from 11:45 AM to 12:20 PM about the value creation and supply chains within the field of work
Patent application for multilayer structures for chemically resistant, long-term stable differential pressure sensors
Harsh environmental conditions require robust and stable pressure sensors. The new and further development of wafer-level packaging technologies increases performance, extends areas of application and reduces manufacturing costs. The result is patent pending
MEMS workshop: Wafer bonding process for pressure sensors
The participants of the CiS MEMS workshop on pressure sensor technology discussed online the development of sensor elements, their assembly, test methods and applications. Innovative AVT, in particular wafer bonding processes, were a focal point this time
Representative of the TMWWDG visits the CiS Research Institute
State Secretary for Science and Higher Education Carsten Feller and Robert Fetter, acting head of the “Technology Promotion” unit, met yesterday afternoon with the management of the CiS Research Institute at its south-east Erfurt location
Differential pressure sensors for use in aggressive media
Simultaneous measurement of differential pressure and process pressure – The approach pursued by CiS uses miniaturised pressure sensors which can be applied to carrier materials such as silicon or ceramics by means of flip-chip technologies. By means of adapted passivation processes (ALD, Parylene, etc.), the pressure sensors are available in a media-resistant design
MOEMS Workshop on NDIR sensor technology successful in 2nd edition
Yesterday, the workshop autum at CiS was continued in an exciting way with the workshop on “Components of NDIR sensor technology” which is already in its second edition. Designed as a hybrid presence and online event, more than 40 experts from research and industry discussed specific infrared sensor development for the analysis of liquid and gaseous substances
