The 10th MikroSystemTechnik Congress will take place in Dresden from 23rd to 25th October 2023. With a focus on sustainable microelectronics, business and science will discuss the topics of electronics, microsystems technology and materials and what contribution they can make to achieving climate goals.
The CiS Research Institute will present selected results of research and development in the field of MEMS and MOEMS components in various lecture and poster sessions.
Already on Tuesday, 24th October, Dr. Thomas Frank, head of the MEMS department, will talk about “Membrane-free pressure sensors for applications above 1000 MPa”. This lecture, in the Materials session, will take place at 5:00 pm in conference room 2-3.
In addition, the topic “Compact nanoindenter with integrated displacement and force sensors” will also be presented on Tuesday between 3:00 pm and 4:00 pm in the poster session “Microsystems in Applications” at stand P1.13A. The subject is the development of a hardness measuring head based on a novel combined force-displacement sensor with a resolution of 100pm for determining the hardness of surfaces in the nanometre range.
In the rubric of sustainability, energy and climate is Poster Session 2, on Wednesday, 25th October 2023. From 2:50 pm to 3:50 pm, the topic “Use of silicon strain sensors for macroscopic test specimens” will be explained at Stand P2.2G. Various possibilities will be presented to achieve high sensitivity to the measurand pressure as well as insensitivity to changes due to the mounting stress. Measures that contribute to the improvement of the long-term stability of hybrid sensors.
The CiS Research Institute is part of the Thuringian consortium in the joint project “KODIAK”. Dr Michael Scholles, Fraunhofer IPMS, will give an insight into the work of the Thuringian consortium in the session “Optical Components” on 24th October 2023. The core of the research activities is the development of electronic, optical and fluidic components and associated integration techniques for fast and inexpensive laboratory tests, including the rapid detection of sepsis. In the project, the CiS Research Institute worked on the focus “Hybrid micro-assembly of micro-optical sensor systems for imaging based on single photons” and thus forms the interface between semiconductor wafer process and system integration on the chip.