Microcondensation sensors for the Japanese market – CiS signs distribution agreement with ESPEC Corp.
CiS Forschungsinstitut für Mikrosensorik GmbH announces the signing of a distribution agreement with ESPEC Corp. on microcondensation sensors for the Japanese market. With this agreement, CiS grants the exclusive right to market and sell customised microcondensation sensors in Japan
With thin pixel radiation detectors close to the collision point
The CiS Research Institute has developed large-area radiation detectors whose sensitive area is thinned down to the thickness of a normal sheet of paper. During processing, it was possible to dispense with the use of additional handling wafers, which is still common practice in industrial production today
Multichannel sensors for the nanolitre rang
A multi-channel measuring head for investigations on sample volumes in the nanolitre range is currently being developed at the CiS Research Institute together with international partners within the framework of the European research project “SMARTER-SI” (GA-Nr. 644596). The principle is based on fluorescence and absorption measurement on an array of different enzyme pixels
European network SMARTER-SI supports companies in manufacturing smart systems
The SMARTER-SI project offers a novel manufacturing platform across Europe on which innovative and intelligent sensor components and microsystems can be produced cost-effectively in small and medium quantities. Around 5.3 million euros in funding will flow into the development and testing of this platform until 2018
Dew sensor with calibrated digital output signal
CiS has expanded its CCC® platform and for the first time offers microcondensation sensors with a calibrated digital output signal.
The aim is to effectively support customer-specific developments (condensate mass, temperature, design, assembly and connection technology)
Highly stable temperature diodes with single-point calibration for the temperature range up to 220°C
At the CiS Research Institute, technological processes for silicon wafers were developed with which a reproducible sensitivity dU/dT, i.e. the slope of the voltage versus temperature, could be achieved
New sensor technologies for pulse contour analysis, determination of heart rate variability and measurement of blood flow in tissue
CiS Research Institute introduces miniaturized silicon integrated multispectral photoplethysmography sensors. These are placed in the external auditory canal and are individually adapted to the patient
Assembly & Packaging – compact, application-specific and industry-relevant
A new micro assembly center expands the technological basis for new concepts for the fully automated production of application-specific UV LED modules in different series sizes. The modular system concept enables the most important AVT assembly steps to be carried out in one device
Wafer technologies for micro laser illuminations
The CiS Research Institute has developed a cost-effective technology for the production of highly stable laser illuminators in a batch process. In this process, up to 20,000 of these modules are mounted on a glass wafer. The VCSEL-based laser modules are characterized by high beam quality
Strain gauges for demanding applications
For precision force measurements, the CiS Research Institute from Erfurt has developed miniaturized silicon strain gages (Si strain gages) with integrated measuring bridge. By using semiconductor technologies, a higher long-term stability, precision and measurement reliability is achieved compared to ductile metal strain gages
