Dr. Martin Schädel, Head of the MOEMS Business Unit, will talk about “Sensor solutions for measuring vital parameters in the ear” in Stage 2 “Medical Technology: Microtechnology for Mobile Diagnostics and Therapy” on Wednesday, August 25, 2021 as part of the IVAM Hightech Summit
The newly designed piezoresistive pressure sensor chips with analog integrated temperature compensation are suitable for operating temperatures of up to about 300°C. The sensor is based on an intelligent connection of the measuring bridge with passive components. The basis is an intelligent interconnection of the measuring bridge with passive components
In the category “Innovative Product or Patent in the Healthcare Sector”, the Senetics Healthcare Group, honors the development of the optical blood pressure sensor at the CiS Research Institute
The technology competition getstarted2gether enters the 4th round. For four weeks, technology-oriented start-up teams now have the opportunity to apply for mentoring projects at a Thuringian research institution (WINAFO). The start-up potential is presented in a 10-minute pitch
The focus is on the development of thermopiles with special absorbers and their fabrication with established semiconductor processes. Through simulations and experiments with demonstrators on selected gases, the function is to be investigated and verified
Encrypted communication with the help of quantum processors – Physics team of the University of Jena and the CiS Research Institute is awarded with highly endowed innovation prize “INNOspace Masters Award” of the “DLR Challenge” for the project “QuVeKS – Quantum Processors for Encrypted Communication with Satellites
Based on a MEMS technology platform, a sensor module was developed that determines the preload force and the operating force as well as their change over time. The user can flexibly design a measurement cycle, thus achieving greater maintenance intervals as well as the possibility of remote diagnostics
The speakers Dr. Martin Schädel as well as Dr. Andreas Winzer presented an online webinar on the topic of “3D structured photodiodes” on 14.07. 2021. In the webinar, which lasted just under one hour, they used illustrative examples to report on the variety of new optical sensor solutions using technologies for 3D processing of silicon
The speakers Dr. Martin Schädel as well as Dr. Andreas Winzer presented an online webinar on the topic of “3D structured photodiodes” on 14.07. 2021. In the webinar, which lasted just under one hour, they used illustrative examples to report on the variety of new optical sensor solutions using technologies for 3D processing of silicon
As a result of advancing automation and autonomously operating machines and systems, low-cost force sensors that can be integrated into the systems are required. Preliminary tests show that silicon strain gauges joined to stainless steel with glass solder can be expected to give good results
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