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3D silicon photodiode with PigTail

18. May 2012/in MOEMS, Packaging, Waferprocessing

The 3D structuring of silicon is becoming increasingly important for optical and opto-electronic applications in microsystems technology. For the reliable and low-loss coupling of optical fibers to photodiodes, the CiS Research Institute developed new microstructuring technologies for the fabrication of cavities with flank angles of 45° and 90° and high optical absorption of the sensitive coupling surface

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https://www.cismst.de/wp-content/uploads/news-2012-05-18-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2012-05-18 13:07:002021-02-23 13:22:573D silicon photodiode with PigTail

Power from light – fieldbus-compatible sensors for extreme operating conditions

17. May 2012/in MOEMS

For the use of sensor systems under extreme conditions, such as in EMC-critical or Ex-protected areas, a galvanic connection of the sensors for energy supply or signal transmission is often not possible. Together with industrial partners, the application center microoptical systems of the CiS research institute developed a solution compatible with existing fieldbus systems

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https://www.cismst.de/wp-content/uploads/news-2012-05-17-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2012-05-17 13:15:002021-02-23 13:19:58Power from light – fieldbus-compatible sensors for extreme operating conditions

ToMess multi-sensor module

16. May 2012/in MEMS

Microstructured reactors have been successfully finding their way into the laboratories and production facilities of large-scale and fine chemistry as well as medicine for several years. Worldwide research activities impressively show that the use of the micro-process engineering components can achieve a multitude of reaction engineering advantages in chemical processes

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https://www.cismst.de/wp-content/uploads/news-2012-05-16-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2012-05-16 11:03:002021-02-23 11:07:38ToMess multi-sensor module

Low temperature silicon direct bonding

15. May 2012/in MEMS, Waferprocessing

Low-temperature silicon direct bonding has gained significantly in importance in recent years. In addition to the possibilities of vertical integration, it opens up new process technology opportunities through the application of wafer-level packaging as a post-process in sensor manufacturing

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https://www.cismst.de/wp-content/uploads/news-2012-05-15-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2012-05-15 11:18:002021-02-23 11:20:38Low temperature silicon direct bonding

Impedance sensor technology at the CiS Research Institute

14. May 2012/in MEMS

CiS has many years of expertise in the field of impedance sensor technology. In addition to the classic field of humidity measurement, new fields of application are being developed

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Optoelectronic sensor ensures reliable refrigeration technology

13. May 2012/in MEMS, MOEMS, Packaging

Based on special chip and assembly technologies from the CiS Research Institute, the ILK Institut für Luft- und Kältetechnik gGmbH, Dresden has developed a cost-effective multi-parameter system for continuous monitoring of humidity, bubble formation, temperature and level in refrigerant systems

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https://www.cismst.de/wp-content/uploads/news-2012-05-13-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2012-05-13 14:02:002021-02-23 14:03:50Optoelectronic sensor ensures reliable refrigeration technology

Jena scientist Astrid Bingel receives honor for outstanding diploma thesis

10. May 2012/in CiS general

For the third time, CiS e.V. awarded a prize for diploma or master theses in the fields of sensors, actuators, microsystems technology and photovoltaics. This prize recognizes outstanding work in these fields, preferably done in conjunction with industry

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https://www.cismst.de/wp-content/uploads/news-2012-05-10-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2012-05-10 14:09:002021-02-23 14:12:09Jena scientist Astrid Bingel receives honor for outstanding diploma thesis

CiS Research Institute becomes affiliated institute of TU Ilmenau

12. August 2011/in CiS general, Personnel

On August 11, 2011, the ceremonial signing of a contract for the recognition of the CiS Research Institute as an affiliated institute of the TU Ilmenau took place during the kick-off event for the Solar Research Initiative at the TU Ilmenau

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https://www.cismst.de/wp-content/uploads/news-2011-08-12-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2011-08-12 08:34:002021-03-03 09:09:09CiS Research Institute becomes affiliated institute of TU Ilmenau
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  • Monitoring of safety-relevant flange gaskets

    21. March 2023
  • Development of high-resolution temperature sensors

    16. March 2023
  • Sensor development for sustainable and safe process control in industry

    6. March 2023
  • Efficient joining process for microsystems technology

    23. February 2023
  • Technology competition getstarted2gether enters sixth round

    13. February 2023

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