The Chinese Association of the Sensor and IoT Industry (SIA) is planning a visit to Germany on 21.06.2019 with a delegation from the sensor and IoT industry, R&D institutions, IoT associations and local IoT industrial parks
On 28.05.2019, nine start-up teams from Thuringia presented themselves to a jury made up of members of the FTVT’s business-related research institutes
The BMBF joint project DiaQuantFab started on 15.5.2019. Within three years, the project partners will develop commercially viable microsensor systems for high-precision magnetic field measurement and calibration-free current measurement based on NV centres in diamond
The Jiangning Development Zone presents 5 start-ups at Viva Technology in Paris from May 16-18, 2019, bringing together promising start-ups and the world’s leading technology companies from a variety of industries and offering opportunities for collaboration and networking
Also in 2019, the CiS Research Institute will be present at the Long Night of Technology at the Technical University of Ilmenau with exciting experiments for all ages
The workshop “Customised MEMS Sensors for Applications in Science, Industry4.0, Automotive and Mobility” presents trends and current results from research, development and application for silicon-based MEMS sensors
On the initiative of the German-Arab Friendship Society, a group of Arab ambassadors visited CiS Forschungsinstitut on April 1, 2019
Dr. Thomas Frank, head of the MEMS department at the CiS Research Institute, explains miniaturized silicon strain sensors, 50 times more sensitive than a conventional metallic foil strain gauge and as small as the head of a pin, on April 4 at 15:00
At the beginning of last week, Expert Committee 4.3 Sensor and Sensor Systems of the VDE/VDI Society for Microelectronics, Microsystems and Precision Engineering (GMM) met at our company to prepare the next conference “Energy Self-sufficient Sensor Systems” (EAS2020) to be held in spring 2020
At HMI 2019, CiS will be presenting sophisticated packaging for time-of-flight camera modules, double-sided microstrip detectors and other current development results in a double pack at the Thuringia joint LEG stand in Hall 4, Stand F34 and at the stand of Forschungs- und Technologieverbund Thüringen e.V. (FTVT) in Hall 2, Booth A27
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