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European network SMARTER-SI supports companies in manufacturing smart systems

27. April 2016/in Measurement, Medical technology, MEMS, MOEMS, Pressure

The SMARTER-SI project offers a novel manufacturing platform across Europe on which innovative and intelligent sensor components and microsystems can be produced cost-effectively in small and medium quantities. Around 5.3 million euros in funding will flow into the development and testing of this platform until 2018

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https://www.cismst.de/wp-content/uploads/news-2016-04-27-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-27 13:39:002021-02-18 13:48:52European network SMARTER-SI supports companies in manufacturing smart systems

Dew sensor with calibrated digital output signal

26. April 2016/in MEMS

CiS has expanded its CCC® platform and for the first time offers microcondensation sensors with a calibrated digital output signal.
The aim is to effectively support customer-specific developments (condensate mass, temperature, design, assembly and connection technology)

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https://www.cismst.de/wp-content/uploads/news-2016-04-26-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-26 14:38:002021-02-18 14:40:38Dew sensor with calibrated digital output signal

Highly stable temperature diodes with single-point calibration for the temperature range up to 220°C

25. April 2016/in Silicon Detectors, Waferprocessing

At the CiS Research Institute, technological processes for silicon wafers were developed with which a reproducible sensitivity dU/dT, i.e. the slope of the voltage versus temperature, could be achieved

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https://www.cismst.de/wp-content/uploads/news-2016-04-25-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-25 15:03:002021-02-18 15:05:46Highly stable temperature diodes with single-point calibration for the temperature range up to 220°C

New sensor technologies for pulse contour analysis, determination of heart rate variability and measurement of blood flow in tissue

24. April 2016/in Medical technology, MOEMS, Packaging

CiS Research Institute introduces miniaturized silicon integrated multispectral photoplethysmography sensors. These are placed in the external auditory canal and are individually adapted to the patient

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https://www.cismst.de/wp-content/uploads/news-2016-04-24-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-24 15:15:002021-02-24 08:59:48New sensor technologies for pulse contour analysis, determination of heart rate variability and measurement of blood flow in tissue

Assembly & Packaging – compact, application-specific and industry-relevant

23. April 2016/in MOEMS, Packaging, UV

A new micro assembly center expands the technological basis for new concepts for the fully automated production of application-specific UV LED modules in different series sizes. The modular system concept enables the most important AVT assembly steps to be carried out in one device

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https://www.cismst.de/wp-content/uploads/news-2016-04-23-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-23 08:45:002022-07-12 10:11:22Assembly & Packaging – compact, application-specific and industry-relevant

Wafer technologies for micro laser illuminations

22. April 2016/in MOEMS, Waferprocessing

The CiS Research Institute has developed a cost-effective technology for the production of highly stable laser illuminators in a batch process. In this process, up to 20,000 of these modules are mounted on a glass wafer. The VCSEL-based laser modules are characterized by high beam quality

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https://www.cismst.de/wp-content/uploads/news-2016-04-22-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-22 09:15:002021-02-19 09:23:50Wafer technologies for micro laser illuminations

Strain gauges for demanding applications

17. March 2016/in Force, MEMS, Packaging

For precision force measurements, the CiS Research Institute from Erfurt has developed miniaturized silicon strain gages (Si strain gages) with integrated measuring bridge. By using semiconductor technologies, a higher long-term stability, precision and measurement reliability is achieved compared to ductile metal strain gages

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https://www.cismst.de/wp-content/uploads/news-2016-03-17-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-03-17 08:20:002021-02-19 08:25:52Strain gauges for demanding applications

Semiconductor Complex Measuring Station

29. January 2016/in Measurement, Pressure

Manufacturing technology and sensors are tested and characterized with a high level of metrological effort in order to be able to demonstrate the desired properties with long-term stability. Different measurement methods are required for this purpose. The new semiconductor complex measuring station represents a milestone in the characterization of technologies and sensors

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https://www.cismst.de/wp-content/uploads/news-2016-01-29-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-01-29 07:56:002021-02-23 13:20:28Semiconductor Complex Measuring Station

“STREAM” – New EU project launched at CiS

25. January 2016/in Events, Jobs, Silicon Detectors

On 18 January 2016, the launch event for a new research project with 11 European partners from Switzerland, Germany, the Netherlands, Great Britain, Austria, Italy, Norway and France took place at CERN. STREAM stands for “Smart Sensor Technologies and Training for Radiation Enhanced Applications and Measurements” and is funded by the EU with 3.9 million euros

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https://www.cismst.de/wp-content/uploads/news-2016-01-25-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-01-25 13:58:002021-02-18 14:05:00“STREAM” – New EU project launched at CiS

Assembly & Packaging – compact, application-specific and industry relevant

17. November 2015/in MOEMS, Packaging, UV

A new micro assembly centre expands the technological basis for the development of technological solutions for the fully automated production of application-specific UV LED modules in different series sizes. The modular system concept enables the most important packaging steps to be carried out in one unit

Read more
https://www.cismst.de/wp-content/uploads/news-2015-11-17-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2015-11-17 08:57:002022-07-12 10:11:59Assembly & Packaging – compact, application-specific and industry relevant
Page 38 of 45«‹3637383940›»
  • Project launch Thermistor-HFS – Development of a novel heat flux sensor

    9. July 2025
  • Project completion Optimization of Thermal Behavior (OTB)

    2. July 2025
  • Wound Light wins award in photo competition

    26. June 2025
  • International conference on superconducting electronics and quantum technologies takes place in Erfurt

    17. June 2025
  • Careers in high-tech – CiS Research Institute at the Thuringian Job Fair

    13. June 2025

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