CiS
  • Research Institute
    • Profile
    • Certification
    • Network
    • Downloads
  • Competences
    • Technologies
    • Simulation & Design
    • Process Development
    • Wafer Processing
    • Assembly & Packaging
    • Measurement & Analytics
    • CAK – CiS Analytics Comptence Center
    • Prototyping & Small Batches
  • R&D
    • Microsensors for the World of Tomorrow
    • MEMS
    • MOEMS
    • Public Research
    • Funding
    • Industry Projects
  • Markets
    • Applications
    • Process measurement technology
    • Energy
    • Mobilty
    • Health
    • Climate
    • Infrared sensor technology
  • Career
    • Working in the Research Environment
    • Staff
    • Students
    • Training
    • Privacy Policy on Applications
  • News
    • News
    • Events
    • Publications & Conferences
  • CiS e.V.
    • The Association
    • Charter (PDF)
    • The Board
    • Contact CiS e.V.
    • Privacy Policy CiS e.V.
  • Contact
    • Contact Persons
    • Approach
    • Imprint
    • Privacy Policy
  • Deutsch
  • Click to open the search input field Click to open the search input field Search
  • Menu Menu

CiS as exhibitor at the Zuse Days

6. June 2016/in Events

The institutes of the Zuse Association presented themselves to the public together for the first time in Berlin on 7 and 8 June 2016. Under the patronage of the Federal Minister of Economics and Technology, Sigmar Gabriel, and with the motto “Research that gets there”, 60 institutes of the Zuse Association provided an insight into their research activities

Read more
https://www.cismst.de/wp-content/uploads/news-zuse-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-06-06 08:42:002021-02-16 08:44:20CiS as exhibitor at the Zuse Days

Microcondensation sensors for the Japanese market – CiS signs distribution agreement with ESPEC Corp.

23. May 2016/in MEMS

CiS Forschungsinstitut für Mikrosensorik GmbH announces the signing of a distribution agreement with ESPEC Corp. on microcondensation sensors for the Japanese market. With this agreement, CiS grants the exclusive right to market and sell customised microcondensation sensors in Japan

Read more
https://www.cismst.de/wp-content/uploads/news-2016-05-23-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-05-23 12:59:002021-02-18 13:07:37Microcondensation sensors for the Japanese market – CiS signs distribution agreement with ESPEC Corp.

With thin pixel radiation detectors close to the collision point

29. April 2016/in Silicon Detectors, Waferprocessing

The CiS Research Institute has developed large-area radiation detectors whose sensitive area is thinned down to the thickness of a normal sheet of paper. During processing, it was possible to dispense with the use of additional handling wafers, which is still common practice in industrial production today

Read more
https://www.cismst.de/wp-content/uploads/news-2016-04-29-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-29 12:22:002021-02-18 12:37:54With thin pixel radiation detectors close to the collision point

Multichannel sensors for the nanolitre rang

28. April 2016/in Analytics, Medical technology, MOEMS

A multi-channel measuring head for investigations on sample volumes in the nanolitre range is currently being developed at the CiS Research Institute together with international partners within the framework of the European research project “SMARTER-SI” (GA-Nr. 644596). The principle is based on fluorescence and absorption measurement on an array of different enzyme pixels

Read more
https://www.cismst.de/wp-content/uploads/news-2016-04-28-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-28 14:19:002021-02-18 14:26:50Multichannel sensors for the nanolitre rang

European network SMARTER-SI supports companies in manufacturing smart systems

27. April 2016/in Measurement, Medical technology, MEMS, MOEMS, Pressure

The SMARTER-SI project offers a novel manufacturing platform across Europe on which innovative and intelligent sensor components and microsystems can be produced cost-effectively in small and medium quantities. Around 5.3 million euros in funding will flow into the development and testing of this platform until 2018

Read more
https://www.cismst.de/wp-content/uploads/news-2016-04-27-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-27 13:39:002021-02-18 13:48:52European network SMARTER-SI supports companies in manufacturing smart systems

Dew sensor with calibrated digital output signal

26. April 2016/in MEMS

CiS has expanded its CCC® platform and for the first time offers microcondensation sensors with a calibrated digital output signal.
The aim is to effectively support customer-specific developments (condensate mass, temperature, design, assembly and connection technology)

Read more
https://www.cismst.de/wp-content/uploads/news-2016-04-26-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-26 14:38:002021-02-18 14:40:38Dew sensor with calibrated digital output signal

Highly stable temperature diodes with single-point calibration for the temperature range up to 220°C

25. April 2016/in Silicon Detectors, Waferprocessing

At the CiS Research Institute, technological processes for silicon wafers were developed with which a reproducible sensitivity dU/dT, i.e. the slope of the voltage versus temperature, could be achieved

Read more
https://www.cismst.de/wp-content/uploads/news-2016-04-25-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-25 15:03:002021-02-18 15:05:46Highly stable temperature diodes with single-point calibration for the temperature range up to 220°C

New sensor technologies for pulse contour analysis, determination of heart rate variability and measurement of blood flow in tissue

24. April 2016/in Medical technology, MOEMS, Packaging

CiS Research Institute introduces miniaturized silicon integrated multispectral photoplethysmography sensors. These are placed in the external auditory canal and are individually adapted to the patient

Read more
https://www.cismst.de/wp-content/uploads/news-2016-04-24-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-24 15:15:002021-02-24 08:59:48New sensor technologies for pulse contour analysis, determination of heart rate variability and measurement of blood flow in tissue

Assembly & Packaging – compact, application-specific and industry-relevant

23. April 2016/in MOEMS, Packaging, UV

A new micro assembly center expands the technological basis for new concepts for the fully automated production of application-specific UV LED modules in different series sizes. The modular system concept enables the most important AVT assembly steps to be carried out in one device

Read more
https://www.cismst.de/wp-content/uploads/news-2016-04-23-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-23 08:45:002022-07-12 10:11:22Assembly & Packaging – compact, application-specific and industry-relevant

Wafer technologies for micro laser illuminations

22. April 2016/in MOEMS, Waferprocessing

The CiS Research Institute has developed a cost-effective technology for the production of highly stable laser illuminators in a batch process. In this process, up to 20,000 of these modules are mounted on a glass wafer. The VCSEL-based laser modules are characterized by high beam quality

Read more
https://www.cismst.de/wp-content/uploads/news-2016-04-22-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-22 09:15:002021-02-19 09:23:50Wafer technologies for micro laser illuminations
Page 40 of 47«‹3839404142›»
  • Project completion KTB: Complex tools for component simulation

    9. December 2025
  • 7th Silicon Science Award – Award ceremony at Waferbond 2025

    4. December 2025
  • Start of ZEBA project: Non-destructive image evaluation using AI-supported imaging to determine burst pressure

    26. November 2025
  • Future prospects at the 4th Sensor and Application Technology Conference in Shenzhen, China

    18. November 2025
  • CiS Research Institute at COMPAMED 2025

    17. November 2025

Categories

  • Analytics (21)
  • Automotive (11)
  • CiS general (32)
  • Digitalization (1)
  • Energy (19)
  • Events (207)
  • Force (47)
  • High Temperature (1)
  • Hydrogen (2)
  • Invest (1)
  • IR (40)
  • Jobs (4)
  • Measurement (23)
  • Medical technology (84)
  • MEMS (174)
  • MOEMS (173)
  • Packaging (61)
  • Personnel (10)
  • Photonic (23)
  • Politics (24)
  • Pressure (68)
  • Process development (5)
  • Quantum (37)
  • Silicon Detectors (21)
  • Simulation & Design (25)
  • UV (28)
  • Waferprocessing (16)

Archives

From design to prototyping.
Reliable. Long-term stable. Precise.

Konrad-Zuse-Str. 14
99099 Erfurt
Germany

Tel.: +49 361 663 1410
E-Mail: info@cismst.de

© 2026 CiS Forschungsinstitut für Mikrosensorik GmbH
  • Start
  • Deutsch
  • Imprint
  • Privacy Policy
  • Sitemap
Scroll to top Scroll to top Scroll to top