Page 46 – CiS

With innovations from Thuringia – Radiation-hard silicon detectors in the search for the Higgs boson

6. July 2012/in Silicon Detectors

Thuringia is significantly involved in the discovery of the Higgs elementary particle. Scientists and engineers of the CiS Forschungsinstitut für Mikrosensorik und Photovoltaik GmbH are working in Erfurt on radiation-hard silicon detectors for the international nuclear research elite at CERN (Geneva). The CiS Research Institute is proud to have contributed decisively to the success with its achievements and congratulates the colleagues in Switzerland

Force sensor for haptic assistance systems in medicine

21. May 2012/in Force, Medical technology, MEMS

A miniaturized force sensor measures the forces at catheter tips that occur between the guide wire (catheter) and blood vessels during insertion. The KASYS mini-chip, just 200 x 220 x 640 µm in size and thus just twice as wide as a hair, is the heart of a haptic assistance system that will simplify catheterizations in medicine in the future and reduce the risk of injury

Non-contact, interferometric distance measurement

20. May 2012/in MOEMS, Packaging

Technologies from microsystems engineering and microoptics form the basis for the successful miniaturization of a new, interferometric distance measurement system from TETRA GmbH in Ilmenau. The core component, consisting of a Michelsen laser interferometer and an optical silicon detector, was developed by the mechatronics specialist together with the Microoptical Systems Application Center at CiS Research Institute

Interferometric pressure sensor

19. May 2012/in MEMS, Waferprocessing

Using MEMS wafer technologies and a silicon photodiode array with embedded laser light source (naked VCSEL), the CiS Research Institute has succeeded in integrating the complete optical sensing of the pressure-sensitive, membrane (Silizum) in a very flat package space – comparable to capacitive or piezoresistive sensors

3D silicon photodiode with PigTail

18. May 2012/in MOEMS, Packaging, Waferprocessing

The 3D structuring of silicon is becoming increasingly important for optical and opto-electronic applications in microsystems technology. For the reliable and low-loss coupling of optical fibers to photodiodes, the CiS Research Institute developed new microstructuring technologies for the fabrication of cavities with flank angles of 45° and 90° and high optical absorption of the sensitive coupling surface

Power from light – fieldbus-compatible sensors for extreme operating conditions

17. May 2012/in MOEMS

For the use of sensor systems under extreme conditions, such as in EMC-critical or Ex-protected areas, a galvanic connection of the sensors for energy supply or signal transmission is often not possible. Together with industrial partners, the application center microoptical systems of the CiS research institute developed a solution compatible with existing fieldbus systems

ToMess multi-sensor module

16. May 2012/in MEMS

Microstructured reactors have been successfully finding their way into the laboratories and production facilities of large-scale and fine chemistry as well as medicine for several years. Worldwide research activities impressively show that the use of the micro-process engineering components can achieve a multitude of reaction engineering advantages in chemical processes

Low temperature silicon direct bonding

15. May 2012/in MEMS, Waferprocessing

Low-temperature silicon direct bonding has gained significantly in importance in recent years. In addition to the possibilities of vertical integration, it opens up new process technology opportunities through the application of wafer-level packaging as a post-process in sensor manufacturing

Impedance sensor technology at the CiS Research Institute

14. May 2012/in MEMS

CiS has many years of expertise in the field of impedance sensor technology. In addition to the classic field of humidity measurement, new fields of application are being developed

Optoelectronic sensor ensures reliable refrigeration technology

13. May 2012/in MEMS, MOEMS, Packaging

Based on special chip and assembly technologies from the CiS Research Institute, the ILK Institut für Luft- und Kältetechnik gGmbH, Dresden has developed a cost-effective multi-parameter system for continuous monitoring of humidity, bubble formation, temperature and level in refrigerant systems