Electronica India, South Asia’s leading trade fair for electronic components, systems, applications, and solutions, will open its doors for three days in Bengaluru. The CiS Research Institute will make its trade show debut in India from September 16 to 18, 2026, in Hall 5 of the Bangalore International Exhibition Centre (BIEC) at the International Pavilion organized by Messe München. As a leading R&D and technology partner for silicon-based microsensors and microsystems, the institute will present a cross-section of its portfolio at booth H5 D75 and take the opportunity to establish new international contacts.
High-pressure sensor with a flush-mounted media connection (DS300MPa)
Using a newly developed technology, silicon-based high-pressure sensors with a flush-mounted media connection can be custom-manufactured for applications exceeding 70 MPa.
Development of a mobile vital signs sensor system for detecting hazardous situations in active leisure activities and for occupational groups subject to particularly high physical demands (MoViSEG)
In collaboration with partners, an optical-digital in-ear sensor unit was developed, along with a lightweight control and transmission unit attached to a helmet, to detect hazardous situations for high-risk occupational groups. During operations—for example, by firefighters—heart rate and oxygen saturation can be monitored to enable the timely implementation of safety measures.
Improving the Stability of Hybrid Silicon Strain Gauges (SiDMeses)
By minimizing installation stresses and achieving high overload resistance, hybrid-structured silicon strain gauges exhibit improved stability. These sensors enable highly precise measurements in a wide range of applications, from automation technology to the hydrogen economy.
Silicon-based custom photodiodes
For the development of photodiodes in the spectral range from 200 to 1100 nm, the contour, size, and segmentation can be freely configured. Using 3D patterning, cavities, holes, and inclined surfaces can be created, and LEDs can be integrated. The integration of additional optical elements allows for a wide range of custom designs.
The research and development work described was funded by the Federal Ministry for Economic Affairs and Energy (BMWE) through the following projects:
“Development of a Mobile Vital Signs Sensor System for Detecting Hazardous Situations in Active Leisure Activities and for Occupational Groups Subject to Particular Stress” (MoViSEG) – Funding code: KK5085707DF4
“Improvement of the Stability of Hybrid-Structured Silicon Strain Sensors” (SiDMeses) –Funding code: 49MF200061
“High-Pressure Sensor with Flush-Mounted Media Connection” (DS300MPa), Funding code: 49MF22001
