Low-temperature silicon direct bonding has gained significantly in importance in recent years. In addition to the possibilities of vertical integration, it opens up new process technology opportunities through the application of wafer-level packaging as a post-process in sensor manufacturing
CiS has many years of expertise in the field of impedance sensor technology. In addition to the classic field of humidity measurement, new fields of application are being developed
Based on special chip and assembly technologies from the CiS Research Institute, the ILK Institut für Luft- und Kältetechnik gGmbH, Dresden has developed a cost-effective multi-parameter system for continuous monitoring of humidity, bubble formation, temperature and level in refrigerant systems
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