Testboard with cantilever
The CiS Research Institute is developing various miniaturized probes made of single-crystalline silicon with integrated piezoresistive measuring bridge for fast inline quality control of components made of a wide range of materials. High sampling rates are enabled by a very low probing force, a high natural frequency (3…5 kHz), and a very small mass (≈0.1 mg). The measurement speed is up to 10 mm/s with a resolution in vertical displacement of 2 nm and a sampling rate of 1600 Hz.
The robustness of the sensor and its signal to the effects of light and temperature changes, electrosmog, as well as to dust and process aids such as drilling oils, allow it to be used under production conditions, e.g. directly in the machining area of machine tools.
The MEMS microprobe is particularly suitable for bores and undercuts that cannot be measured with either an AFM or a profilometer. The low contact force required also enables the non-destructive measurement of plastic components, e.g. micro-optical structures.
The sensor closes the gap between an AFM and the classic stylus instrument. The resolution is lower than with the AFM, but the measuring speed and the measuring range are much larger.
The sensors can be delivered as bare chip, as circuit board with analog or digital output (test board) or as customer specific setups.
Project presentation at:
SENSOR+TEST, May 19-21, 2015, Nuremberg, Hall 12 Booth 132
