CiS at the SPIE Photonics West in San Francisco
The SPIE Photonics West in San Francisco, the world’s largest event for photonic technologies, will start on Saturday with three conferences and two trade fairs
Sensors for biomedicine presented at the 25th Innovation Day of the BMWi
/in Events, Medical technology, MEMS, Packaging, PressureOur exhibition at the Innovation Day of SMEs of the BMWi on June 7, 2018 in Berlin generated good feedback and high interest. Here, our research institute presented the INNO-KOM project “Wafer Level Packaged Pressure Sensor With Through Silicon Vias”
Workshop „Future Technologies for Radiation Detectors”
/in Analytics, Events, Packaging, Silicon DetectorsFor the 3rd time, the international workshop “Future of Silicon Detector Technologies” focused on technologies and devices for the development and production of radiation detectors. The focus was also on future research priorities in order to be able to manufacture sensors with extremely high radiation hardness with long-term stability and at low cost. In particular, the new experiments at CERN and at the Gesellschaft für Schwerionenforschung (Society for Heavy Ion Research) in Darmstadt require this radiation hardness in addition to other technical parameters
06.02.2018: CiS at SPIE Photonics West 2018
/in Events, MOEMS, Packaging, Photonic, WaferprocessingFor the first time, CiS Forschungsinstitut für Mikrosensorik GmbH was represented as an exhibitor at SPIE Photonics West 2018 in San Francisco. As one of 70 German exhibitors in the German Pavilion in the North Hall of the Moscone Center, the CiS Research Institute demonstrated its expertise in the design as well as the manufacture and assembly of customised optical microsensors
Reliable Measurement of Pressure, Force or Strain – Piezoresistive Sensor Elements in Medical Technology
/in Force, Measurement, Medical technology, MEMS, Packaging, PressurePiezoresistive pressure sensor chips from CiS are used where high precision, stability and reliability are required. The same sensor principle is now also used for force measurement in silicon strain gages. The strain-sensitive resistors are monolithically integrated into wafer-thin chips as Wheatstone measuring bridge
Microsystems technologies for medical applications
/in Analytics, Events, Medical technology, PackagingDevelopers and manufacturers of sensor technology, medical technology and bioanalytics met for the 1st workshop in Erfurt on 10 May 2017 to present innovative solutions from microsystems technology in prevention, diagnosis, analytics and therapy and to network interdisciplinarily
Barometric MEMS pressure sensor for bio- and medical technology
/in Medical technology, MEMS, Packaging, PressureAt Sensor+Test 2017, the CiS Research Institute for Microsensors presents highly stable, media-resistant barometric pressure sensors in MEMS technology
Mounting UV LEDs flexibly and efficiently – Fully automatic micro-assembly centre with diversity
/in MOEMS, Packaging, UVA new micro-assembly centre expands the technological basis for the development of technological solutions for the fully automated assembly of application-specific UV LED modules in different series sizes and designs, whether as single LED sources or area lamps.
The modular system concept enables the most important AVT assembly steps to be carried out in one unit
Fast and small spectral sensors for fibre Bragg gratings
/in MOEMS, PackagingThe MEMS technologies available and further developed at the CiS Research Institute were the basis for the development of a new generation of spectral sensors consisting of two detector chips stacked on top of each other. Each covers a specific spectral range. The upper diode is only 50 µm thin
Silicon strain gauge
/in Force, Measurement, Medical technology, MEMS, Packaging, PressureFor precision force measurements, the CiS Research Institute has developed miniaturised silicon strain gauges (Si-DMS) with an integrated measuring bridge. The piezoresistive resistors are monolithically integrated in single-crystal silicon (K-factor = 80) and are available as a double strain element and as a full bridge