Trade Fair Sensor+Test and Congress SMSI
Next week, the SENSOR+TEST 2021 trade fair and the accompanying international congress SMSI 2021 will start. Both events will take place online and the CiS Research Institute will be represented with a digital presence and a presentation. Get your free online ticket
Photoacoustic sensors based on wafer-level packaging
Photoacoustic sensors measure carbon dioxide and nitrogen oxides with high sensitivity. Increasingly, other gases such as methane, ammonia, ethylene or gas leaks in pipelines are being detected. In the PAS project, the CiS Research Institute is starting the development of an integrated photoacoustic gas sensor based on NDIR sensors
Exhibition booth at HM21 Digital Edition
This week at HM21 Digital Edition, we present current research topics and project results in the development of silicon-based MEMS and MOEMS sensor concepts
Happy Easter – Creative competition for the children of our employees
The management of the CiS Research Institute invited to a creative participation action for the children of our employees. In our online gallery you can admire the numerous creative submissions of the young artists. Happy Easter days and stay healthy
First Status Workshop of the BMBF Growth Core HIPS
The 1st status workshop of the BMBF growth core HIPS will take place on April 7, 2021 as a free online event. Organized by the host TU Ilmenau, guests and interested parties are welcome from 9:00 to 16:30. The CiS Research Institute is involved in two projects to develop an innovative multi-sensor platform for capturing sensor information in challenging environments
Further development of the founding project “Ultra-wideband microwave sensor technology”
The CiS Research Institute uses its competences in packaging and interconnection technology for the further development of the founding project of Ilmsens GmbH. Processes such as chip-to-chip contacts with extremely short and flat loops as well as long-term stable, hermetic packaging drive the miniaturization of the “system-in-package” sensor
H2MEMS – Novel hydrogen sensor with highest sensitivity and selectivity based on silicon-based MEMS sensor structures
As a specialist in the development of silicon-based pressure sensors, the CiS Research Institute is developing and testing palladium-coated MEMS structures with its partners in the H2MEMS project. The volume expansion of palladium during hydrogen deposition is being tested as a measuring principle
SPIE Photonics West 2021 as an online event
SPIE Photonics West 2021 will take place from March 6 to 11 as an online-only event. As part of OPTO 2021, the CiS Research Institute will give two presentations on current research results on the emission behavior of UV LEDs and on down converters for driving UV LEDs. The lectures are available for registered participants during the whole period of the event
NanoSense – Development of a hardness measuring head based on a novel combined force-displacement sensor
For the determination of surface hardness in the nanometer range, a new measuring head combining a force and displacement sensor is being developed in the recently launched “NanoSense” project. It is to be connected modularly to common universal testing machines and XY-axis manipulators
Webinar with Live Demo: Silicon-based Piezoresistive Force Sensors
MEMS-based piezoresistive force sensors can be used to monitor preload forces or contact forces. Our webinar will go into the technical basics of such sensors and we will show you some demonstrators of silicon strain gauges (Si strain gauges) developed by us
