Direct contact with the medium is difficult to implement for silicon-based microsensors. In order to fully exploit miniaturisation, corrosion protection is applied at chip level. This makes an application in more demanding environments possible even without additional protective constructions
Increasing the quantum efficiency of silicon diodes in scanning electron microscopes – The SiekeV research project is working on improving scanning electron microscopes for analysing near-surface structures. The detection of low-energy electrons makes it possible to take very surface-sensitive SEM images
Since a classic joint end-of-year event with all colleagues is not possible this year, the management of the CiS Research Institute engaged the Burgermann Foodtruck. With a sophisticated corona-compliant ordering procedure, all employees were able to choose from different burger menus and enjoy their pre-Christmas thank-you for their commitment in this not easy year yesterday lunchtime
A new technology platform is used for targeted optical adaptation of an SNSPD silicon chip stack. This is an extremely compact construction of a superconducting detector with efficient signal coupling in a chip compound as well as integrated optics and mounting of a fibre
At InnoCON Thuringia on 24th November 2020, Dr. Olaf Brodersen will explain the latest results of the growth core HIPs and the SiCer technologies to be developed therein for high performance sensor systems. The InnoCON starts as online event at 3:00 PM
The CiS Research Institute has been working for more than 10 years on the development of photoplethysmographic sensors for the continuous measurement of vital parameters such as heart rate, heart rate variability and blood oxygen saturation. The most recent result is a miniaturised sensor that also monitors blood pressure in the ear
The 10th advisory board meeting of the Advanced UV for Life (AUVL) consortium is taking place today as an online event. The CiS Research Institute is the coordinator of the working field “Modules & Measurement Technology”. Prof. Thomas Ortlepp will give a lecture from 11:45 AM to 12:20 PM about the value creation and supply chains within the field of work
Harsh environmental conditions require robust and stable pressure sensors. The new and further development of wafer-level packaging technologies increases performance, extends areas of application and reduces manufacturing costs. The result is patent pending
The participants of the CiS MEMS workshop on pressure sensor technology discussed online the development of sensor elements, their assembly, test methods and applications. Innovative AVT, in particular wafer bonding processes, were a focal point this time
State Secretary for Science and Higher Education Carsten Feller and Robert Fetter, acting head of the “Technology Promotion” unit, met yesterday afternoon with the management of the CiS Research Institute at its south-east Erfurt location
Konrad-Zuse-Str. 14
99099 Erfurt
Germany
Tel.: +49 361 663 1410
E-Mail: info@cismst.de
