The central idea of integrating several small and therefore fast active areas into a single chip was initially achieved through the hybrid integration of individual, very small (1×1 mm²) chips, which were ultimately converted into variants of monolithically integrated arrays
From 31st March to 4th April 2025, the CiS Research Institute will be presenting its technology portfolio at #hmi25. In Hall 6 at the LEG joint stand in Thuringia (Stand F61), our experts will be presenting silicon-based MEMS and MOEMS sensor concepts for a wide range of applications
The leading photonics exhibition in the ASEAN region will take place from 26th-28th February at Marina Bay Sands. At the special exhibition area Photonics + Europe presented by IVAM, EPIC and W3+ of IVAM, at booth C206, the CiS Research Institute will present an excerpt of its portfolio and Prof. Thomas Ortlepp will give a lecture on “Photonic Quantum Sensor Based on Diamond NV-Centers – Hybrid Integration and Performance Evaluation”
From 12th-15th November 2024, we will be showcasing a selection of our research and development results. The European semiconductor industry will meet in the halls of Messe München. Interested visitors will find our stand at the joint Thuringian LEG stand C1718 in Hall C1. We look forward to your visit and a stimulating exchange of ideas
During the Hannover Messe, which starts next week, the CiS Research Institute will be presenting an electrically isolated incremental sensor at the joint Thuringian stand in Hall 3, Stand D76. As part of the GalGiS funding project, new silicon technologies have been developed to achieve such galvanic isolation at chip level
In the newly opened research project, IR emitter arrays are developed, which are characterized by high dynamics and simultaneously large beam strength
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Germany
Tel.: +49 361 663 1410
E-Mail: info@cismst.de
