At the Windmesse Symposium in Hamburg, visitors will learn more about technical innovations, economic aspects and the market development of on- and offshore wind energy. In his bolt sensor lecture on October 5, 2021, Arndt Steinke will provide information on “Innovative preload force sensors for bolted connections”
The newly designed piezoresistive pressure sensor chips with analog integrated temperature compensation are suitable for operating temperatures of up to about 300°C. The sensor is based on an intelligent connection of the measuring bridge with passive components. The basis is an intelligent interconnection of the measuring bridge with passive components
Based on a MEMS technology platform, a sensor module was developed that determines the preload force and the operating force as well as their change over time. The user can flexibly design a measurement cycle, thus achieving greater maintenance intervals as well as the possibility of remote diagnostics
As a result of advancing automation and autonomously operating machines and systems, low-cost force sensors that can be integrated into the systems are required. Preliminary tests show that silicon strain gauges joined to stainless steel with glass solder can be expected to give good results
Start for the preliminary research project “High-End Acceleration Sensors”(HEB) – The project aims at the development of a CMOS-compatible manufacturing process for high-resolution capacitive MEMS acceleration sensors with a resolution of 0.001⁰ for cost-efficient application as tilt sensor
The digital edition of the BMWi 2021 SME Innovation Day will take place on June 17, 2021. Under the heading Success Stories, the CiS Research Institute presents the successful INNO-KOM project Miniaturized Infra-Red Emitter Chip (MIREC)
In the virtual session “Safety First! Pt.1 at ACHEMA Pulse, Dr. Klaus Ettrich will present the topic: “Innovative sensors for monitoring mechanical connections” on 15.06.2021 at 14:20
For the measurement of clamping forces in safety-relevant bolted joints, the CiS Research Institute developed a sensitive washer including a measuring method for detecting and testing
As part of the M-Gravi project, the CiS Research Institute is developing novel gravity sensors for high-precision exploration of the geological features of the Earth’s surface. The sensors consist of four individual silicon wafers and use a wafer-level stacking technology
Our second online webinar on the topic of “Silicon-based Piezoresistive Force Sensors” on 20.04.2021 was a complete success. The speakers Dr. Klaus Ettrich, Business Unit Manager MEMS, Dr. Thomas Frank, Department Manager MEMS, and André Grün, Development Engineer Packaging Technology, presented MEMS-based piezoresistive force sensors for monitoring preload forces or contact forces
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