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Successful continuation of the “Stropos” project with Healyan

31. March 2023/in Events, Medical technology, MOEMS

At yesterday’s sixth edition of the technology competition “getstartet2gether”, the young startup Healyan was once again able to convince the jury of its concept and will continue the development of a low-cost stroboscopic therapy glasses together with the CiS Research Institute

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https://www.cismst.de/wp-content/uploads/news-2023-03-31-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-03-31 13:22:082023-03-31 13:22:24Successful continuation of the “Stropos” project with Healyan

Investigation of the freezing out effect

30. March 2023/in MEMS, Pressure

In the freezing-out project, quantum mechanical calculations and extensive measurements were performed on semiconductors in the temperature range from 300K to 4K. This served to put future simulations in the MEMS area and the semiconductor industry in this temperature range on a better data basis and to make them more reliable

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https://www.cismst.de/wp-content/uploads/news-2023-03-30-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-03-30 09:35:142023-03-30 09:35:31Investigation of the freezing out effect

Monitoring of safety-relevant flange gaskets

21. March 2023/in Events, MEMS, Packaging

Under the motto “Pipelines in Climate Change”, the 37th Pipeline Technology Symposium starts today in Dortmund. Colleagues from the field of MEMS, report in their presentation on “Innovative sensor technology for flange gasket monitoring”. The conference deals with topics related to pipeline technology, valve technology, plant technology and industrial service

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https://www.cismst.de/wp-content/uploads/news-2023-03-21-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-03-21 10:15:232023-03-21 10:16:49Monitoring of safety-relevant flange gaskets

Development of high-resolution temperature sensors

16. March 2023/in MEMS

The newly launched Si Heat-Flux Sensor (Si-HFS) project aims to realize the smallest possible, low-cost sensor elements that are capable of detecting the physical quantity temperature not only as a precise absolute value, but also highly dynamically as a vector quantity

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Sensor development for sustainable and safe process control in industry

6. March 2023/in Events, MEMS, MOEMS

Under the motto “Sensor technology future trends and sensor impulses for industrial users” the Institute for Sensor and Actuator Technology of the Coburg University of Applied Sciences invites to the already 3rd Technology Day Applied Sensor Technology (TAS). On 9th March 2023, the CiS Research Institute participates with a technical lecture and a place in the accompanying exhibition

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Efficient joining process for microsystems technology

23. February 2023/in Process development, Waferprocessing

The current project “JoinZiSi – Optimized reactive bonding technology based on novel zirconium systems for use in microsystems technology” is concerned with the development of an efficient joining process and is representative of the research work in the Process Development department at the CiS Research Institute

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https://www.cismst.de/wp-content/uploads/news-2023-02-23-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-02-23 09:20:142023-02-23 09:20:58Efficient joining process for microsystems technology

Technology competition getstarted2gether enters sixth round

13. February 2023/in Events

The application phase of the technology competition getstarted2gether is open until 9th March 2023. The competition, which has already entered its 6th round, is aimed at motivated Thuringian startups and developer teams. Together with one of the ten business-related research institutions (Winafo) in Thuringia, innovative technologies can be further developed within a period of six months and the latest infrastructure of the research institutions of the FTVT and their established networks can be used

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https://www.cismst.de/wp-content/uploads/news-2023-02-13-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-02-13 07:01:002023-02-10 14:18:58Technology competition getstarted2gether enters sixth round

Stress-independent temperature measurement in the new SOT project

8. February 2023/in Force, Packaging

The newly launched research project “Stress-independent on-chip temperature sensing for silicon strain gauges (SOT)” aims at developing a temperature sensing of piezoresistive transducers optimized with respect to mechanical stress. This is to be achieved by using on-chip integrated bipolar structures

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https://www.cismst.de/wp-content/uploads/news-2023-02-08-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-02-08 08:10:482023-02-08 08:11:06Stress-independent temperature measurement in the new SOT project

From microchip to gas sensor system

2. February 2023/in Events, IR, MOEMS

On 7th February 2023, from 9 to 11 AM, Dr. Martin Schädel, business manager MOEMS at CiS Research Institute will jointly present Steffen Biermann, director of development & industrial engineering at Micro-Hybrid Electronic, on the development “From Microchip to Gas Sensor System” in the current edition of the digital event series “Spotlights of Micro- and Nanotechnology

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https://www.cismst.de/wp-content/uploads/news-2023-02-02-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-02-02 12:52:332023-02-02 12:53:08From microchip to gas sensor system

Intelligent sensor technology at the Lightweight Forum Thuringia

26. January 2023/in Energy, Events

In the accompanying exhibition to today’s Lightweight Construction Forum Thuringia of the TITK Rudolstadt, the CiS Research Institute for Microsensors demonstrates development results that contribute to the development of a hydrogen economy as well as efficient energy generation and use in a variety of applications to conserve resources

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https://www.cismst.de/wp-content/uploads/news-2023-01-26-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-01-26 07:38:112023-01-26 07:38:28Intelligent sensor technology at the Lightweight Forum Thuringia
Page 16 of 47«‹1415161718›»
  • Project completion KTB: Complex tools for component simulation

    9. December 2025
  • 7th Silicon Science Award – Award ceremony at Waferbond 2025

    4. December 2025
  • Start of ZEBA project: Non-destructive image evaluation using AI-supported imaging to determine burst pressure

    26. November 2025
  • Future prospects at the 4th Sensor and Application Technology Conference in Shenzhen, China

    18. November 2025
  • CiS Research Institute at COMPAMED 2025

    17. November 2025

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