The new ZIM project IR-Batch focuses on the development of new assembly technologies for infrared components based on polymer-free joining technologies for use at high temperatures and in extreme environmental conditions. The CiS Research Institute is responsible for technology development
The ambitious goal of the research project was achieved with the successful development of a silicon-based high-pressure sensor with front-flush media contact for a measuring range up to 300 MPa. The front-flush media connection makes the sensor ideal for sensitive areas with strict hygiene regulations, such as in the food industry or pharmaceuticals
The central idea of integrating several small and therefore fast active areas into a single chip was initially achieved through the hybrid integration of individual, very small (1×1 mm²) chips, which were ultimately converted into variants of monolithically integrated arrays
The new Thermistor-HFS research project aims to develop and manufacture a novel heat flow sensor based on a fundamentally different technological approach than solutions already available on the market
In the OTB project, scientists at the CiS Research Institute pursued the goal of reducing or optimizing cross-sensitivity for highly stable and highly accurate piezoresistive resistance bridges consisting of resistance tracks implanted in single-crystal silicon with a high temperature coefficient
With his photo “Aufgewundenes Licht” (Wound Light), our colleague Bernd Sprenger won third place in this year’s “NanObjectives 5.0” photo competition. His photo, taken with a scanning electron microscope at 100x magnification, shows a coiled filament in a standard household light bulb. We warmly congratulate our colleague Bernd Sprenger on his success
The International Superconductive Electronics Conference (ISEC), the biennial scientific conference that brings together global experts in the field of superconductive electronics in a forum, kicked off in Erfurt on Monday. The international series of events is being held at the Radisson Blu Hotel Erfurt until Thursday and covers key topics for the future, such as quantum computers and energy-efficient electronics, and provides a forum for innovations in science and industry
Starting tomorrow, the CiS Research Institute will be presenting its portfolio for the first time at EPHJ, an international trade fair for high precision in Geneva. Until 6th June 2025, we will be presenting our silicon-based sensor technologies and expertise in the field of MEMS and MOEMS to an international audience of experts at booth J122 in the Palexpo halls in Geneva
During a visit by students from KOMET (Conference of Medical Technology Student Councils from German-speaking Countries) on May 26, 2025, they were able to gain a small insight into our fascinating world of microsensor technology. MEMS Business Unit Manager Dr. Klaus Ettrich presented a selected range of sensor developments for medical applications. Dr. Bernd Hähnlein generated enthusiasm and practical relevance at the scanning electron microscope of the CiS Analytics Competence Center with the finest structures that are invisible to the naked eye
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Germany
Tel.: +49 361 663 1410
E-Mail: info@cismst.de
