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With thin pixel radiation detectors close to the collision point

29. April 2016/in Silicon Detectors, Waferprocessing

The CiS Research Institute has developed large-area radiation detectors whose sensitive area is thinned down to the thickness of a normal sheet of paper. During processing, it was possible to dispense with the use of additional handling wafers, which is still common practice in industrial production today

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https://www.cismst.de/wp-content/uploads/news-2016-04-29-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-29 12:22:002021-02-18 12:37:54With thin pixel radiation detectors close to the collision point

Multichannel sensors for the nanolitre rang

28. April 2016/in Analytics, Medical technology, MOEMS

A multi-channel measuring head for investigations on sample volumes in the nanolitre range is currently being developed at the CiS Research Institute together with international partners within the framework of the European research project “SMARTER-SI” (GA-Nr. 644596). The principle is based on fluorescence and absorption measurement on an array of different enzyme pixels

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https://www.cismst.de/wp-content/uploads/news-2016-04-28-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-28 14:19:002021-02-18 14:26:50Multichannel sensors for the nanolitre rang

European network SMARTER-SI supports companies in manufacturing smart systems

27. April 2016/in Measurement, Medical technology, MEMS, MOEMS, Pressure

The SMARTER-SI project offers a novel manufacturing platform across Europe on which innovative and intelligent sensor components and microsystems can be produced cost-effectively in small and medium quantities. Around 5.3 million euros in funding will flow into the development and testing of this platform until 2018

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https://www.cismst.de/wp-content/uploads/news-2016-04-27-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-27 13:39:002021-02-18 13:48:52European network SMARTER-SI supports companies in manufacturing smart systems

Dew sensor with calibrated digital output signal

26. April 2016/in MEMS

CiS has expanded its CCC® platform and for the first time offers microcondensation sensors with a calibrated digital output signal.
The aim is to effectively support customer-specific developments (condensate mass, temperature, design, assembly and connection technology)

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https://www.cismst.de/wp-content/uploads/news-2016-04-26-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-26 14:38:002021-02-18 14:40:38Dew sensor with calibrated digital output signal

Highly stable temperature diodes with single-point calibration for the temperature range up to 220°C

25. April 2016/in Silicon Detectors, Waferprocessing

At the CiS Research Institute, technological processes for silicon wafers were developed with which a reproducible sensitivity dU/dT, i.e. the slope of the voltage versus temperature, could be achieved

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https://www.cismst.de/wp-content/uploads/news-2016-04-25-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-25 15:03:002021-02-18 15:05:46Highly stable temperature diodes with single-point calibration for the temperature range up to 220°C

New sensor technologies for pulse contour analysis, determination of heart rate variability and measurement of blood flow in tissue

24. April 2016/in Medical technology, MOEMS, Packaging

CiS Research Institute introduces miniaturized silicon integrated multispectral photoplethysmography sensors. These are placed in the external auditory canal and are individually adapted to the patient

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https://www.cismst.de/wp-content/uploads/news-2016-04-24-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-24 15:15:002021-02-24 08:59:48New sensor technologies for pulse contour analysis, determination of heart rate variability and measurement of blood flow in tissue

Assembly & Packaging – compact, application-specific and industry-relevant

23. April 2016/in MOEMS, Packaging, UV

A new micro assembly center expands the technological basis for new concepts for the fully automated production of application-specific UV LED modules in different series sizes. The modular system concept enables the most important AVT assembly steps to be carried out in one device

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https://www.cismst.de/wp-content/uploads/news-2016-04-23-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-23 08:45:002022-07-12 10:11:22Assembly & Packaging – compact, application-specific and industry-relevant

Wafer technologies for micro laser illuminations

22. April 2016/in MOEMS, Waferprocessing

The CiS Research Institute has developed a cost-effective technology for the production of highly stable laser illuminators in a batch process. In this process, up to 20,000 of these modules are mounted on a glass wafer. The VCSEL-based laser modules are characterized by high beam quality

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https://www.cismst.de/wp-content/uploads/news-2016-04-22-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-22 09:15:002021-02-19 09:23:50Wafer technologies for micro laser illuminations

Strain gauges for demanding applications

17. March 2016/in Force, MEMS, Packaging

For precision force measurements, the CiS Research Institute from Erfurt has developed miniaturized silicon strain gages (Si strain gages) with integrated measuring bridge. By using semiconductor technologies, a higher long-term stability, precision and measurement reliability is achieved compared to ductile metal strain gages

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https://www.cismst.de/wp-content/uploads/news-2016-03-17-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-03-17 08:20:002021-02-19 08:25:52Strain gauges for demanding applications

Semiconductor Complex Measuring Station

29. January 2016/in Measurement, Pressure

Manufacturing technology and sensors are tested and characterized with a high level of metrological effort in order to be able to demonstrate the desired properties with long-term stability. Different measurement methods are required for this purpose. The new semiconductor complex measuring station represents a milestone in the characterization of technologies and sensors

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https://www.cismst.de/wp-content/uploads/news-2016-01-29-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-01-29 07:56:002021-02-23 13:20:28Semiconductor Complex Measuring Station
Page 44 of 51«‹4243444546›»
  • InOxA Project Completion: Innovative Oxide Structures for the Passivation of Silicon Interfaces

    12. August 2026
  • PJS Project Completion: On-chip multisensors based on the piezo-junction effect

    5. August 2026
  • CryoMAG-RX Project Launch: High-Precision Temperature Sensor for Cryogenic Temperatures

    29. July 2026
  • oLGAD Project Launch: Low-Gain Avalanche Detector with Ultra-Thin Oxides

    22. July 2026
  • Completion of the HIVOS Project: Hybrid Integrated Optical Sensors Based on Pre-structured Adhesive Layers

    15. July 2026

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