For the second time, the CiS Research Institute for Microsensors is presenting the latest research findings on silicon-based sensor technology at Semicon Europe in Munich. Our experts will be available for in-depth discussions at the joint booth of the Thuringia State Development Corporation in Hall B1, Booth 317, from November 10 through 13. Held at the Munich Trade Fair grounds, Semicon Europe is considered one of the most important gathering places for the European semiconductor industry and takes place concurrently with the international electronica trade show.
Our highlights at the Thuringia joint booth this year are (click for PDF info sheets):
- Rapid IC Prototyping Using Advanced Bonding Technologies (News article)
- Piezoresistive Technology Platform with Minimal Offset (Infosheet: miniOffset)
- Highly sensitive, low-noise blue-violet avalanche photodiode for diagnostics (Infosheet: BVAPD)
- Hardness measurement probe based on a novel combined force-displacement sensor (Infosheet: NanoSense)
- High-pressure sensor up to 300 MPa with flush-mounted media connection (Infosheet: DS300MPa)
- Galvanically Isolated Incremental Sensor (Infosheet: GalGIS)
The research and development work described was funded by the Federal Ministry for Economic Affairs and Energy (BMWE) through the following research projects:
Technology Platform with Minimal Offset (miniOffset)
Funding code: 49MF220087
High-Sensitivity, Low-Noise Blue-Violet Avalanche Photodiodes (BVAPD)
Funding code: 49MF200098
Development of a hardness measurement probe based on a novel combined force-displacement sensor with a resolution of 100 pm for determining the hardness of surfaces in the nanometer range (NanoSense)
Funding code: KK5085702SN0
High-pressure sensor with flush-mounted media connection (DS300MPa)
Funding code: 49MF220019
Galvanically isolated incremental sensor (GalGIS)
Funding code: 49VF123456
