The IMAPS Fall Conference will be held in Munich on October 21 and 22. The conference, initiated by the International Microelectronics and Packaging Society (IMAPS), is an important platform for technical discussions between industry and academia as well as production and research.
Representatives from the coordination office of the “High Performance Sensors – HIPS” growth core will present current results at the accompanying exhibition.
In the HIPS growth core, twelve Thuringian industrial companies and seven research institutions – including the CiS Research Institute – are working together to bring the patented SiCer technology, a unique combination of silicon technology (Si) with ceramic multilayer technology (Cer), to industrial application maturity.
Department Head for Process Development, Dr. Indira Käpplinger is Chair of the session “Ceramic Substrates”. Our colleague André Grün reports in the session “Materials & Processes” on “Innovative joining technologies for the assembly of humidity and temperature stable force sensor systems based on piezoresistive silicon strain gauges”.