Page 14 – CiS

Successful workshop on assembly and connection technology

13. September 2023/in Events, Packaging

At the workshop “Current developments in hybrid and wafer-level assembly” on 12th September 2023 in Erfurt, experts from mechanical and plant engineering, semiconductor foundries, scientists and AVT experts discussed individual processes in packaging and interconnection technology, their technical status and future potential with a focus on silicon-based microsystems. All participants agreed: the workshop offered numerous, exciting contributions as well as opportunities for exchange, networking and idea generation

Silicon Science Award 2023 presented to Lukas Leon Barthelmann

5. September 2023/in CiS general, Events

A total of five outstanding works by young researchers were honored yesterday with the Silicon Science Award. The award ceremony took place on 4th September 2023, as part of the opening event of the international 60th Ilmenau Scientific Colloquium “Engineering for a Changing World” in the Audimax of the Ilmenau University of Technology

Current developments in hybrid and wafer-level assembly

4. September 2023/in Events, Packaging

The CiS Workshop with focus on packaging and interconnect technology will take place on 12th September 2023 in Erfurt under the motto “Current developments in hybrid and wafer-level assembly”. Look forward to exciting contributions as well as ample opportunity for professional exchange and networking

Improvement of the stability of hybrid silicon strain sensors (SiDMeses)

31. August 2023/in MEMS, Packaging, Pressure

In the SiDMeses research project, the long-term stability of hybrid silicon strain sensors was significantly improved by a targeted and accelerated reduction of the mechanical assembly stress and a precise, extremely parallel and symmetrical structure was generated

Project start Thermopiles with carbon nanotube absorbers

23. August 2023/in MOEMS

The new project “Thermopiles with carbon nanotube absorbers” investigates the integration of thin coatings of carbon nanotubes on thermopiles with the aim of enabling higher absorption at low cost

Project start KoSenDi: Compact sensor unit for measuring magnetic fields using diamond fluorescence

16. August 2023/in MOEMS, Packaging

In the newly started project KoSenDi (Compact Sensor Unit for the Measurement of Magnetic Fields Using Diamond Fluorescence), scientists at the CiS Research Institute are working on the miniaturization of a magnetic field sensor based on sticksoff defects (NV centers) in diamond

Project start NivLer: Retrofit kit for non-invasive pressure measurement

9. August 2023/in Measurement, MEMS, Pressure

The new research project NivLer at the CiS Research Institute addresses the development of a retrofit kit for non-invasive pressure measurement in process pipes in order to be able to non-destructively record and digitize various condition variables

Project start DiaTip: Active diamond-based scanning probes for QUANTUM metrology and nanofabrication – development of hybrid assembly methods

2. August 2023/in MEMS, Quantum

The CiS Research Institute is partner of the started joint project “DiaTip”. Together with the partners, the efficient production of diamond tips as well as a suitable assembly process for the joining of two components “active microcantilever” and “diamond tip” shall be developed

Novel material combinations and sensor geometries for resistance thermometers in the hydrogen economy

26. July 2023/in MEMS, Pressure

In the new project Cryo-Resistance both the further development of industrially manufactured resistance thermometers in cooperation with UST Umweltsensortechnik GmbH and several layout variants based on semiconductor technologies of the CiS Research Institute are pursued

Hybrid integrated optical sensors based on pre-structured adhesive layers

19. July 2023/in MOEMS, Packaging, Process development

The “Hivos” project follows the industry’s request and aims at higher automation by deposition and patterning of adhesive coatings at wafer level and the associated improved assembly accuracy. Innovative materials and processes are also intended to increase value creation at wafer/benefit level