Webinar: 3D structured photodiodes
In this 60-minute webinar, Dr. Andreas Winzer and Dr. Martin Schädel will use illustrative examples to report on the variety of new optical sensor solutions using technologies for 3D processing of silicon
In this 60-minute webinar, Dr. Andreas Winzer and Dr. Martin Schädel will use illustrative examples to report on the variety of new optical sensor solutions using technologies for 3D processing of silicon
As part of the “Advanced UV for Life” online workshop, Prof. Thomas Ortlepp will report on current project results in his presentation “UV-LED lamps with integrated digital control” on May 20, 2021. The aim of the project is to control the light intensity of UV-LEDs with low current ripple
Mid-Week Coffee Break – At the virtual technology talk of the IVAM trade association, the CiS Research Institute is the host on 19.05.2021. Our business unit manager MOEMS Dr. Martin Schädel will give the participants an insight into the topic “IR components for contactless temperature measurement and gas analysis”
ams & CiS Forschungsinstitut enter into strategic R&D partnership. Both partners expect synergy effects from the cooperation in order to make innovative optical sensor solutions for the acquisition of vital data available to patients and end users in the form of wearables and hearables in the near future
Today, the winners of the AMA Innovation Award 2021 will be awarded during the conference “Sensor and Measurement Science International”. Research teams of the CiS Research Institute and Fritsch GmbH have also applied with a joint development project “Particle Measurement by Laser Diffraction
Next week, the SENSOR+TEST 2021 trade fair and the accompanying international congress SMSI 2021 will start. Both events will take place online and the CiS Research Institute will be represented with a digital presence and a presentation. Get your free online ticket
This week at HM21 Digital Edition, we present current research topics and project results in the development of silicon-based MEMS and MOEMS sensor concepts
The CiS Research Institute uses its competences in packaging and interconnection technology for the further development of the founding project of Ilmsens GmbH. Processes such as chip-to-chip contacts with extremely short and flat loops as well as long-term stable, hermetic packaging drive the miniaturization of the “system-in-package” sensor
SPIE Photonics West 2021 will take place from March 6 to 11 as an online-only event. As part of OPTO 2021, the CiS Research Institute will give two presentations on current research results on the emission behavior of UV LEDs and on down converters for driving UV LEDs. The lectures are available for registered participants during the whole period of the event
The market for thermopile sensors is growing and will continue to gain from the current COVID pandemic. In the current project NIVo two established principles are combined to a novel isothermal sensor by front cavities and thus the innovation capability in this field is further developed
