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Healthy climate thanks to a new type of CO2 detection

13. June 2016/in MOEMS

A new innovation action project called SMARTER-SI offers European companies a new production platform for the efficient manufacturing of innovative and intelligent sensor components and microsystems in small and medium quantities

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https://www.cismst.de/wp-content/uploads/news-2016-06-13-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-06-13 09:37:002021-02-18 09:48:31Healthy climate thanks to a new type of CO2 detection

CiS as exhibitor at the Zuse Days

6. June 2016/in Events

The institutes of the Zuse Association presented themselves to the public together for the first time in Berlin on 7 and 8 June 2016. Under the patronage of the Federal Minister of Economics and Technology, Sigmar Gabriel, and with the motto “Research that gets there”, 60 institutes of the Zuse Association provided an insight into their research activities

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https://www.cismst.de/wp-content/uploads/news-zuse-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-06-06 08:42:002021-02-16 08:44:20CiS as exhibitor at the Zuse Days

Microcondensation sensors for the Japanese market – CiS signs distribution agreement with ESPEC Corp.

23. May 2016/in MEMS

CiS Forschungsinstitut für Mikrosensorik GmbH announces the signing of a distribution agreement with ESPEC Corp. on microcondensation sensors for the Japanese market. With this agreement, CiS grants the exclusive right to market and sell customised microcondensation sensors in Japan

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https://www.cismst.de/wp-content/uploads/news-2016-05-23-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-05-23 12:59:002021-02-18 13:07:37Microcondensation sensors for the Japanese market – CiS signs distribution agreement with ESPEC Corp.

With thin pixel radiation detectors close to the collision point

29. April 2016/in Silicon Detectors, Waferprocessing

The CiS Research Institute has developed large-area radiation detectors whose sensitive area is thinned down to the thickness of a normal sheet of paper. During processing, it was possible to dispense with the use of additional handling wafers, which is still common practice in industrial production today

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https://www.cismst.de/wp-content/uploads/news-2016-04-29-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-29 12:22:002021-02-18 12:37:54With thin pixel radiation detectors close to the collision point

Multichannel sensors for the nanolitre rang

28. April 2016/in Analytics, Medical technology, MOEMS

A multi-channel measuring head for investigations on sample volumes in the nanolitre range is currently being developed at the CiS Research Institute together with international partners within the framework of the European research project “SMARTER-SI” (GA-Nr. 644596). The principle is based on fluorescence and absorption measurement on an array of different enzyme pixels

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https://www.cismst.de/wp-content/uploads/news-2016-04-28-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-28 14:19:002021-02-18 14:26:50Multichannel sensors for the nanolitre rang

European network SMARTER-SI supports companies in manufacturing smart systems

27. April 2016/in Measurement, Medical technology, MEMS, MOEMS, Pressure

The SMARTER-SI project offers a novel manufacturing platform across Europe on which innovative and intelligent sensor components and microsystems can be produced cost-effectively in small and medium quantities. Around 5.3 million euros in funding will flow into the development and testing of this platform until 2018

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https://www.cismst.de/wp-content/uploads/news-2016-04-27-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-27 13:39:002021-02-18 13:48:52European network SMARTER-SI supports companies in manufacturing smart systems

Dew sensor with calibrated digital output signal

26. April 2016/in MEMS

CiS has expanded its CCC® platform and for the first time offers microcondensation sensors with a calibrated digital output signal.
The aim is to effectively support customer-specific developments (condensate mass, temperature, design, assembly and connection technology)

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https://www.cismst.de/wp-content/uploads/news-2016-04-26-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-26 14:38:002021-02-18 14:40:38Dew sensor with calibrated digital output signal

Highly stable temperature diodes with single-point calibration for the temperature range up to 220°C

25. April 2016/in Silicon Detectors, Waferprocessing

At the CiS Research Institute, technological processes for silicon wafers were developed with which a reproducible sensitivity dU/dT, i.e. the slope of the voltage versus temperature, could be achieved

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https://www.cismst.de/wp-content/uploads/news-2016-04-25-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-25 15:03:002021-02-18 15:05:46Highly stable temperature diodes with single-point calibration for the temperature range up to 220°C

New sensor technologies for pulse contour analysis, determination of heart rate variability and measurement of blood flow in tissue

24. April 2016/in Medical technology, MOEMS, Packaging

CiS Research Institute introduces miniaturized silicon integrated multispectral photoplethysmography sensors. These are placed in the external auditory canal and are individually adapted to the patient

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https://www.cismst.de/wp-content/uploads/news-2016-04-24-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-24 15:15:002021-02-24 08:59:48New sensor technologies for pulse contour analysis, determination of heart rate variability and measurement of blood flow in tissue

Assembly & Packaging – compact, application-specific and industry-relevant

23. April 2016/in MOEMS, Packaging, UV

A new micro assembly center expands the technological basis for new concepts for the fully automated production of application-specific UV LED modules in different series sizes. The modular system concept enables the most important AVT assembly steps to be carried out in one device

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https://www.cismst.de/wp-content/uploads/news-2016-04-23-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2016-04-23 08:45:002022-07-12 10:11:22Assembly & Packaging – compact, application-specific and industry-relevant
Page 41 of 48«‹3940414243›»
  • Project completion Si-Heat Flux Sensor: a novel heat flux sensor

    25. February 2026
  • Trade fair premiere at Germany’s leading trade fair for security and defense

    19. February 2026
  • Presentation at the 21st “Trento” Workshop on Advanced Silicon Radiation Detectors

    12. February 2026
  • In-ear vital sensor for emergency personnel, mountain climbers, and air sports enthusiasts to detect dangerous situations

    6. February 2026
  • Project completion Nanolever: Sensor for determining layer stress

    4. February 2026

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