RiSeQ – CiS

Redundant temperature measurement and high-precision, piezoresistive angular rate sensors at Hannover Messe 2023

12. April 2023/in Events, MEMS, MOEMS

At Hannover Messe 2023, the CiS Research Institute will present current development results at the joint booth of LEG Thüringen in Hall 3 Booth H 26, including high-precision, piezoresistive angular rate sensor for autonomous offline navigation as well as redundant temperature sensors based on Si-temperature diodes and platinum resistance elements up to an operating temperature of 300 °C.
In hall 2, booth C 57, the CiS Research Institute is also present at the booth of the FTVT e.V.

CiS Research Institute exhibits at the Thuringian Mobility Forum in Ilmenau

14. September 2022/in Events, MOEMS

On 15.09. the CiS Research Institute presents its competences for a networked and intelligent infrastructure at the accompanying fair to the Thuringian Forum Mobility on the campus of the TU Ilmenau. Silicon-based sensors for hydrogen concentration measurement, sensors for CO2 measurement in breathing gas and indoor spaces or even special light incidence sensors will be shown at booth A8

Tech-Expo for the 30th anniversary of GFE in Schmalkalden

23. June 2022/in Events, Force, MEMS

On the occasion of the Tech-Expo celebrating the 30th anniversary of GFE – Gesellschaft für Fertigungstechnik und Entwicklung Schmalkalden e.V. we showed microsensor technology for production and manufacturing technology. All the best for 30 years of developments and innovations

Thuringian development team wins AMA Innovation Award 2022

12. May 2022/in Events, Force, IR, Medical technology, MEMS, MOEMS

Together with CiS Forschungsinstitut für Mikrosensorik GmbH, 5microns GmbH and Siegert TFT Thinfilm Technology GmbH, Micro-Hybrid Electronic GmbH from Hermsdorf receives the prestigious award for the development of a technology platform for highly reliable NDIR gas sensors

Highlights at Sensor+Test 2022 in Nuremberg

3. May 2022/in Events, Force, IR, MEMS, MOEMS, Pressure

From May 10-12, 2022, Sensor+Test, the world’s leading forum for sensor, measurement and testing technology, will once again be held as a presence event. We look forward to showing interested visitors the latest results of our research and development work at our booth 1-501 in Hall 1 of the Exhibition Center Nuremberg

Technology Brunch of GEOkomm e.V. with CiS Research Institute

29. April 2022/in Events, Force, MEMS

In the context of the GEOkomm (Association of the GeoInformation Industry Berlin-Brandenburg e.V.) Technology Brunch Klaus Ettrich will present our customized MEMS sensor solutions for industry, medicine and agriculture on the basis of two current development results next Friday. Be there too!

Highlights at Sensor+Test 2022 and nominated for the AMA Innovation Award 2022

11. March 2022/in Events, MEMS, MOEMS, Pressure

CiS Research Institute presents highlight at Sensor+Test 2022 as part of the AMA Association’s annual press conference. At the same time, together with Micro-Hybrid Electronic, Siegert Thin Film Technologie and 5microns, we are nominated for the AMA Innovation Award 2022 with the development of a technology platform for highly reliable NDIR gas sensors

SPIE Photonics West 2022 in San Francisco

20. January 2022/in Events, IR, MOEMS

We are very pleased to be back in San Francisco next week as an exhibitor in the German Pavilion at SPIE Photonics West and to be able to present the latest development results

Recording of our latest MOEMS webinar is available [video]

23. July 2021/in Events, MOEMS

The speakers Dr. Martin Schädel as well as Dr. Andreas Winzer presented an online webinar on the topic of “3D structured photodiodes” on 14.07. 2021. In the webinar, which lasted just under one hour, they used illustrative examples to report on the variety of new optical sensor solutions using technologies for 3D processing of silicon

Microsensing the direction of light incidence

17. April 2017/in MOEMS

The CiS Research Institute has developed a tiny microchip to determine the direction of light incidence. The small design and simple integrability as well as the MEMS manufacturing technology suitable for mass production distinguish the component. The monolithic sensor is based on four integrated photodiodes in a 3D-structured silicon substrate

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