Together with CiS Forschungsinstitut für Mikrosensorik GmbH, 5microns GmbH and Siegert TFT Thinfilm Technology GmbH, Micro-Hybrid Electronic GmbH from Hermsdorf receives the prestigious award for the development of a technology platform for highly reliable NDIR gas sensors
From May 10-12, 2022, Sensor+Test, the world’s leading forum for sensor, measurement and testing technology, will once again be held as a presence event. We look forward to showing interested visitors the latest results of our research and development work at our booth 1-501 in Hall 1 of the Exhibition Center Nuremberg
In the context of the GEOkomm (Association of the GeoInformation Industry Berlin-Brandenburg e.V.) Technology Brunch Klaus Ettrich will present our customized MEMS sensor solutions for industry, medicine and agriculture on the basis of two current development results next Friday. Be there too!
CiS Research Institute presents highlight at Sensor+Test 2022 as part of the AMA Association’s annual press conference. At the same time, together with Micro-Hybrid Electronic, Siegert Thin Film Technologie and 5microns, we are nominated for the AMA Innovation Award 2022 with the development of a technology platform for highly reliable NDIR gas sensors
We are very pleased to be back in San Francisco next week as an exhibitor in the German Pavilion at SPIE Photonics West and to be able to present the latest development results
The speakers Dr. Martin Schädel as well as Dr. Andreas Winzer presented an online webinar on the topic of “3D structured photodiodes” on 14.07. 2021. In the webinar, which lasted just under one hour, they used illustrative examples to report on the variety of new optical sensor solutions using technologies for 3D processing of silicon
The CiS Research Institute has developed a tiny microchip to determine the direction of light incidence. The small design and simple integrability as well as the MEMS manufacturing technology suitable for mass production distinguish the component. The monolithic sensor is based on four integrated photodiodes in a 3D-structured silicon substrate