MEMS – Page 14

Foundation of the German-Chinese MEMS Smart Sensor Institute

28. November 2017/in Events, MEMS

On 28 November 2017, the “German-Chinese MEMS Smart Sensor Institute” was founded in Jiangsu, China. The aim is the joint development and industrialisation of novel MEMS sensors and systems. The CiS Research Institute in Erfurt serves as a role model. The independent research institute, which is close to the economy, was selected because it has been developing MEMS for over 20 years and has been very successful in transferring them to industrial production

Reliable Measurement of Pressure, Force or Strain – Piezoresistive Sensor Elements in Medical Technology

9. November 2017/in Force, Measurement, Medical technology, MEMS, Packaging, Pressure

Piezoresistive pressure sensor chips from CiS are used where high precision, stability and reliability are required. The same sensor principle is now also used for force measurement in silicon strain gages. The strain-sensitive resistors are monolithically integrated into wafer-thin chips as Wheatstone measuring bridge

Bolt 4.0 presented at Hannovermesse

3. May 2017/in Events, Force, MEMS, Politics

For the first time, CiS presented a new sensor for testing special bolt in safety-relevant applications at the joint stand of LEG Thüringen at the Hannover Messe 2017. Described as “Bolt 4.0”, the model impressed the trade visitors

Barometric MEMS pressure sensor for bio- and medical technology

24. April 2017/in Medical technology, MEMS, Packaging, Pressure

At Sensor+Test 2017, the CiS Research Institute for Microsensors presents highly stable, media-resistant barometric pressure sensors in MEMS technology

Synthetic diamond coatings in microsystems technology

20. April 2017/in MEMS, Pressure, Quantum

Synthetic diamond coatings can be manufactured on an industrial scale to be CMOS-compatible. The manufacturing and processing costs are comparable to those of other technologies, such as passivation or contacting. In order to implement diamond coatings as passive as well as active functional layers in sensors and to evaluate their industrial applicability, the CiS Research Institute is dedicated to pressure measurement in aggressive working environments and intelligent thermal management in current R&D projects

Better safe than sorry – measurement of pretensioning forces in bolted joints

16. April 2017/in MEMS

At the CiS Research Institute, new types of silicon-based MEMS sensors are currently being developed to check safety-relevant bolt connections. Such special bolts are used, for example, in mechanical engineering, materials handling technology and wind turbines

Silicon strain gauge

7. October 2016/in Force, Measurement, Medical technology, MEMS, Packaging, Pressure

For precision force measurements, the CiS Research Institute has developed miniaturised silicon strain gauges (Si-DMS) with an integrated measuring bridge. The piezoresistive resistors are monolithically integrated in single-crystal silicon (K-factor = 80) and are available as a double strain element and as a full bridge

MEMS design for highly stable and high-precision pressure sensors – CiS Forschungsinstitut für Mikrosensorik cooperates with TU Hamburg-Harburg

17. June 2016/in MEMS, Pressure

Researchers and developers from both institutions are working together on a project to achieve greater reliability in the development and production of application-specific piezoresistive pressure sensors with a multi-physical simulation

Microcondensation sensors for the Japanese market – CiS signs distribution agreement with ESPEC Corp.

23. May 2016/in MEMS

CiS Forschungsinstitut für Mikrosensorik GmbH announces the signing of a distribution agreement with ESPEC Corp. on microcondensation sensors for the Japanese market. With this agreement, CiS grants the exclusive right to market and sell customised microcondensation sensors in Japan

European network SMARTER-SI supports companies in manufacturing smart systems

27. April 2016/in Measurement, Medical technology, MEMS, MOEMS, Pressure

The SMARTER-SI project offers a novel manufacturing platform across Europe on which innovative and intelligent sensor components and microsystems can be produced cost-effectively in small and medium quantities. Around 5.3 million euros in funding will flow into the development and testing of this platform until 2018